Evaluation Kit for RA6M3 MCU Group
The EK-RA6M3 evaluation kit enables users to seamlessly evaluate the features of the RA6M3 MCU Group and develop embedded systems applications using the Flexible...
The EK-RA6M5 evaluation kit enables users to effortlessly evaluate the features of the RA6M5 MCU Group and develop embedded systems applications using the Flexible Software Package (FSP) and e2 studio IDE. Utilize rich on-board features along with your choice of popular ecosystem add-ons to bring your big ideas to life.
Date | ||
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PDF 1.63 MB 日本語 | Quick Start Guide | |
PDF 5.10 MB 日本語 | Manual - Development Tools | |
ZIP 52.77 MB | Schematic | |
PPS 40.98 MB | Presentation | |
PPS 13.99 MB | Presentation | |
PDF 70 KB | Application Note | |
PDF 1.86 MB 日本語 | Application Note | |
PDF 1.96 MB | Application Note | |
PDF 1.92 MB | Application Note | |
PDF 1.04 MB | Application Note | |
PDF 1.36 MB 日本語 | Application Note | |
PDF 3.75 MB 简体中文 | Application Note | |
PDF 1.20 MB | Application Note | |
PDF 597 KB | Quick Start Guide | |
PDF 2.02 MB | Application Note | |
PDF 2.98 MB 日本語 | Application Note | |
PDF 1.12 MB | Application Note | |
PDF 3.50 MB | Application Note | |
PDF 1.06 MB 日本語 | Application Note | |
PDF 698 KB 日本語 | Application Note | |
PDF 2.44 MB 简体中文 | Application Note | |
PDF 1.64 MB | Application Note | |
PDF 2.53 MB | Application Note | |
PDF 1.11 MB | Application Note | |
24 items
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Software title
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Software type
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Company
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Flexible Software Package (FSP) FSP is an enhanced software package designed to provide easy-to-use, scalable, high-quality software for embedded system designs using Renesas RA Family of Arm Microcontrollers.
Note: FSP with e² studio Installer (Platform Installer) will install the e² studio tool, FSP packs, GCC toolchain, and Segger J-Link drivers required to use this software. No additional installations are required.
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Software Package | Renesas |
Renesas Flash Programmer (Programming GUI) Flash memory programming software [Support MCU/MPU and devices: RA, RE, RX, RL78, RH850, Renesas Synergy, Power Management, Renesas USB Power Delivery Family, ICs for Motor Driver/Actuator Driver, V850, 78KR, 78K0]
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Programmer (Unit/SW) | Renesas |
SEGGER™ J-Link™ Software and Documentation Package Software utilities, firmware updates, and supporting documentation for the J-Link on-board programmer and debugger on the RA MCU kits.
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Software Package | SEGGER |
Quick-Connect IoT Platform Quick-Connect IoT platform enables fast prototyping by providing compatible hardware and software building blocks.
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Other Hardware | Renesas |
4 items
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Filters
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Title | Type | Date Date |
[Software=RA FSP],[Board=EK-RA6M5]
ZIP
29.67 MB
IDE:
e2 studio/GCC/AC6, IAR, Keil MDK
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Sample Code | |
ZIP 3.36 MB | Sample Code | |
ZIP 1.93 MB | Sample Code | |
[Software=FSP|v4.4.0],[Toolchain: GCC ARM Embedded | 10.3.1.20210824]
ZIP
1.87 MB
Compiler:
GNUARM-NONE
IDE:
e2 studio
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Sample Code | |
ZIP 4.63 MB | Sample Code | |
ZIP 2.86 MB | Sample Code | |
ZIP 7.36 MB | Sample Code | |
[Software=FSP | v4.3.0],[Toolchain: IAR compiler v9.32.1, ARM compiler v6.15]
ZIP
2.90 MB
IDE:
e2 studio
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Sample Code | |
ZIP 855 KB | Sample Code | |
MCUboot is a secure bootloader for 32-bit MCUs. It defines a common infrastructure for the bootloader, defines system flash layout on microcontroller systems, and provides a secure bootloader that enables easy software update.
[Toolchains=GCC Arm Embedded|9.3.1.20200408] [Software=RA FSP|v4.2.0] [Board=EK-RA6M3;EK-RA6M4]
ZIP
29.00 MB
Compiler:
GNU Arm Embedded
IDE:
e2 studio
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Sample Code | |
[Software=FSP|v4.0.0]
ZIP
29.61 MB
Compiler:
GNUARM-NONE
IDE:
e2 studio
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Sample Code | |
ZIP 12.60 MB | Sample Code | |
ZIP 13.95 MB | Sample Code | |
ZIP 1.04 MB 日本語 | Sample Code | |
ZIP 1.46 MB | Sample Code | |
ZIP 2.21 MB | Sample Code | |
This application project is built with the integrated “Azure IoT SDK for Embedded C” package which allows
small embedded (IoT) devices like Renesas RA family of MCUs RA6M3, RA6M4, and RA6M5 to
communicate with Azure services.
ZIP
9.71 MB
IDE:
e2 studio
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Sample Code | |
The application project uses the Flexible Software Package (FSP) of
the RA family|| the GNU GCC compiler|| and the integrated development environment e2 studio IDE to
demonstrate an exception handling flow for multiple possible faults.
ZIP
2.69 MB
Compiler:
GNU ARM Embedded
IDE:
e2 studio, Keil
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Sample Code | |
18 items
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The EK-RA6M3 evaluation kit enables users to seamlessly evaluate the features of the RA6M3 MCU Group and develop embedded systems applications using the Flexible...
The EK-RA6M4 evaluation kit enables users to effortlessly evaluate the features of the RA6M4 MCU Group and develop embedded systems applications using the Flexible...
The EK-RA6M2 evaluation kit enables users to effortlessly evaluate the features of the RA6M2 MCU Group and develop embedded systems applications using the Flexible...
The EK-RA6M1 evaluation kit enables users to effortlessly evaluate the features of the RA6M1 MCU Group and develop embedded systems applications using Renesas' Flexible...
Select an orderable part number:
Orderable Part ID | Sample |
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RTK7EKA6M5S00001BE | Availability |
Kickstart IoT and embedded systems development using Renesas EK-RA6M5, EK-RA6M4, and EK-RA6M3 evaluation kits for the RA6 MCU series. This video provides an overview of the kit architecture, key features, a quick start example project, and many useful resources to begin innovating quickly with Renesas RA MCUs.
Renesas RA6 Series Innovation Kits for Connected IoT Applications | Blog Post | Apr 5, 2022 | |
Develop Faster Using Example Projects for RA MCU Innovation Kits for IoT | Blog Post | Dec 3, 2021 | |
Quickly Programming RA MCU Innovation Kits for IoT | Blog Post | Dec 3, 2021 | |
Accelerate Debugging Using RA MCU Innovation Kits for IoT Applications | Blog Post | Nov 15, 2021 | |
Beginning to Innovate Has Never Been Easier | Blog Post | Nov 11, 2021 |
The EK-RA6M5 meets the following certifications/standards. Refer to the EK-RA6M5 user manual for the disclaimer, precautions, and more details on the certifications.