Overview
Description
Currently, the development for autonomous driving has progressed and the number of connections between the instrument cluster and various sensors, information, and control devices are increasing. This is leading to an increasing amount of information being displayed on the instrument cluster to realize, including information on the vicinity of the car during driving. At the same time, from the point of view of safety, the need for increased visibility is increasing, and it is necessary to render graphics smoothly. Also, due to advances in LCD display technology, the trends towards larger sizes, higher resolution, and lower costs in automotive LCD displays are progressing. As a result, 3D clusters are becoming more widely used in the instrument cluster field.
Renesas has released the R-Car D3e automotive system SoC to address smooth rendering of high-quality 3D graphics and reduce development steps and costs, which are challenges for the development of entry-class 3D clusters.
Features
- Using the PowerVR Series8XE 3D graphics cores from Imagination Technologies' latest series, the R-Car D3e achieves approximately six times the rendering performance of the existing R-Car D1
- System developers creates 3D clusters using low-cost 4-layer printed circuit boards and reduce the number of parts, that enables reduced system bill of materials (BOM) costs and achieves system costs as low as current 2D cluster systems
- Renesas is working together with industry-leading partners in the instrument cluster field to provide solutions that will reduce development steps and costs
Specifications
- Product No.: R-Car D3e (R8A779M7)
- Power supply voltage: 3.3/1.8V (IO), 2.5V (Ether), 1.5V (DDR3) / 1.35V (DDR3L), 1.03V (core)
- CPU core: Arm®Cortex®-A53
- Cache memory
- L1 Instruction cache: 32KB
- L1 Operand cache: 32KB
- L2 cache: 128KB
- External memory
- DDR3/DDR3L-SDRAM
- Approved standards: DDR3-1866/DDR3L-1866
- Data bus width: 16-bit x 1ch
- Graphics
- 3D Graphics Processing Unit: IMG PowerVR Series8XE GE8300
- 2D Graphics Processing Unit
- Video
- Display Out x 2ch (LVDS x 2 or LVDS + Digital RGB)
- Video Input x 1ch (Digital RGB)
- Up and down scaling, color conversion, rotate, dithering, sharpness
- Distortion compensation module (IMR-LSX4)
- Video output check
- Display Output Compare Unit (DISCOM)
- Video-Output-Checker (VOC)
- Audio
- Sampling rate converter x 2ch
- Serial sound interface x 2ch
- Storage interfaces
- USB 2.0 host/function interface x 1 port (wPHY)
- Multimedia card interface x 1ch
- Raw NAND Flash memory interface x 1ch
- In-car network and automotive peripherals
- Media local bus (MLB) Interface x 1ch (3-pin interface)
- Controller area network (CAN-FD support) Interface x 2ch
- Ethernet AVB 1.0-compatible MAC built in
- Interface: RGMII
- Ethernet AVB (802.1BA)
- IEEE802.1BA
- IEEE802.1AS
- IEEE802.1Qav
- IEEE1722
- Security
- Crypto engine (AES, DES, Hash, RSA)
- SystemRAM
- Other peripherals
- SYS-DMAC x 24ch, Realtime-DMAC x 8ch, Audio-DMAC x 16ch, Audio(peripheral)-DMAC x 4ch
- 32-bit timer x 26ch
- PWM timer x 4ch
- I2C bus interface x 4ch
- Serial communication interface (SCIF) x 11ch
- SPI Multi I/O Bus Controller (RPC) x 2ch (HyperFlash x 1ch support)
- Clock-synchronized serial interface (MSIOF) x 4ch (SPI/IIS)
- Low power mode
- Module standby mode
- DDR-SDRAM power supply backup mode
- Package: 401-pin FCBGA 0.8mm pitch (19mm x 19mm)
- Development environment: ICE for Arm CPU available from tool vendors
- Evaluation board: A user system development reference platform with the following features is also available to enable the users to carry out efficient system development.
- Incorporates car information system-oriented peripheral circuits, providing users with an actual device verification environment.
- Can be used as a software development tool for application software, etc.
- Allows easy implementation of custom user functions.
- Software Platform: Supported OS: Linux, QNX® Neutrino® RTOS, Integrity® etc.
Arm and Cortex are registered trademarks of Arm Limited PowerVR is a trademark of Imagination Technologies Limited. HyperFlash is a trademark of Cypress Semiconductor Corporation. QNX, neutrino and Blackberry are trademarks from BlackBerry Limited, and are used with permission from QNX Software System Limited. Green Hills Software and INTEGRITY are trademarks or registered trademarks of Green Hills Software, Inc. in the U.S. and/or internationally. All names of other products or services mentioned in this press release are trademarks or registered trademarks of their respective owners.
Comparison
Applications
Design & Development
Software & Tools
Sample Code
Boards & Kits
Development
RTP0RC77995SEB0010S
Active
3D Graphics Cluster R-Car D3 Development Board/Draak
R-Car D3, peripheral circuits, and interfaces provide a 3D graphics cluster solution. This development board allows developers to evaluate the R-Car D3 SoC and kickstart hardware and software solutions.
Recommended Documents:
Models
ECAD Models
Schematic symbols, PCB footprints, and 3D CAD models from SamacSys can be found by clicking on the CAD Model links in the Product Options table. If a symbol or model isn't available, it can be requested directly from SamacSys.
Models
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| Type | Title | Date |
| Model - Power Calculator | XLSM 549 KB | |
| Model - Power Calculator | PDF 936 KB 日本語 | |
| Model - Thermal | ZIP 1.70 MB | |
| Model - Power Calculator | ZIP 1.28 MB | |
| Model - BSDL | ZIP 8 KB | |
| Model - IBIS | ZIP 344 KB | |
| Model - Thermal | PDF 2.06 MB | |
| Model - Other | ZIP 1.08 MB | |
| Model - S-parameter | ZIP 3.71 MB | |
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