The ZSSC3230  is a CMOS integrated circuit for accurate capacitance-to-digital conversion and sensor-specific correction of capacitive sensor signals. Digital compensation of sensor offset, sensitivity, and temperature drift is accomplished via an internal digital signal processor running a correction algorithm with calibration coefficients stored in a non-volatile, multiple-time programmable (MTP) memory. Programming the ZSSC3230 is simple via the serial interface. The interface is used for the PC-controlled calibration procedure, which programs the set of calibration coefficients in memory. The ZSSC3230 is configurable for capacitive sensors with capacitances up to 30pF and will provide a scalable up to 18 bit output resolution. It is compatible with single ended capacitive sensors. Measured and corrected sensor values can be output as I2C™ (≤ 3.4MHz).

The ZSSC3230 provides accelerated signal processing, increased resolution, and improved noise immunity in order to support high-speed control, safety, and real-time sensing applications with highest requirements for energy efficiency.


  • Supply Voltage 1.68–3.6V 
  • Low current consumption with 1.3µA at 1 sample per second
  • Maximum target input capacitance: 30pF
  • Programmable capacitance span and offset
  • High sampling rate with 430Hz at 14-bit resolution
  • ADC resolution: adjustable in speed and resolution, 18-bit in maximum
  • Internal auto-compensated temperature sensor, not stress sensitive
  • Programmable measurement sequence, single shot and automatic cycling of measurements with end-of-sequence interrupt output
  • Oversampling modes by internal averaging
  • Interrupt features
  • Build in NVM for configuration and free space for arbitrary user data
  • Small die size
  • External reset pin (low active)
  • No external trimming components required
  • Highly integrated CMOS design
  • Package: Die and 24-VFQFPN

Product Options

Part Number Part Status Pkg. Type Lead Count (#) Temp. Range Carrier Type Buy Sample
Active WAFER 0 -40 to 85°C Wafer
Active WAFER 0 -40 to 85°C Wafer
Active VFQFPN 24 0 to 70°C Reel
Active WAFER 0 -40 to 85°C Wafer
Active WAFER 0 -40 to 85°C Wafer
Active WAFER 0 -40 to 125°C Wafer
Active WAFER 0 -40 to 125°C WFP
Active WAFER 0 -40 to 85°C Wafer
Active VFQFPN 24 -40 to 125°C Reel
Active VFQFPN 24 -40 to 125°C Reel

Documentation & Downloads

Title language Type Format File Size Date
Datasheets & Errata
ZSSC3230 Datasheet Datasheet PDF 1.34 MB
User Guides & Manuals
ZSSC3230 Calibration Guide Guide PDF 1.02 MB
ZSSC3230 Evaluation Kit Manual Manual - Eval Board PDF 3.41 MB
IDT CAD Altium Libraries for AID Products Rev 20160819 Guide ZIP 1.20 MB
Application Notes & White Papers
IDT Wafer Dicing Guidelines Application Note PDF 144 KB
ZSSC323x Evaluation Software Rev. 1.3.15 Software ZIP 3.79 MB
Sensing Technologies and Sensor Solutions Overview Overview PDF 5.75 MB
ZSSC3230 Technical Brief - Die and Wafer Information Technical Brief PDF 647 KB
Choosing the Right Sensor Signal Conditioning IC Miscellaneous PDF 300 KB
Sensor Signal Conditioning ICs for Industrial and Consumer Applications 日本語 Overview PDF 2.93 MB

Boards & Kits

Part Number Title Type Company
ZSSC3230KIT Evaluation Kit for ZSSC3230 Evaluation Renesas