Renesas Mobile's SP2531 Multi-Mode Platform Named as CES Innovations 2012 Design and Engineering Award Honoree

The SP2531 is Designed to Accelerate Mass Market LTE

11 Nov 2011

TOKYO, Japan, November 11, 2011 — Renesas Mobile Corporation (RMC), an innovative supplier of advanced cellular semiconductor solutions and platforms, today announced that its SP2531, the company's first triple mode (EDGE, HSPA+ and LTE) modem chipset reference platform has been named an International CES Innovations 2012 Design and Engineering Awards Honoree in the Embedded Technologies category.

 

Products entered in this prestigious program are judged by a panel of independent industrial designers, engineers and members of the media to recognize and honor outstanding design and engineering in cutting edge consumer electronics products across 32 product categories.

 

“The demand for cloud based content continues to grow exponentially, as do the opportunities for devices that enable untethered access,” commented Jean-Marie Rolland, Chief Technical Officer and Executive Vice President, Sales and Marketing for Renesas Mobile Corporation. “At the same time, Operators want to see LTE move down the price curve quickly. The SP2531 provides a fast track route for our customers to bring LTE functionality to the mass-market and to unlock the network efficiencies that the technology promises. Its recognition as a CES Innovations Honoree is a testament to the tireless work of the RMC product teams dedicated to ensuring that the SP2531 provides the most effective foundation for accelerating the adoption of LTE in the mass market.”

 

The SP2531 comprises a highly integrated baseband modem, an RF subsystem containing the RF integrated chip, front end module, a power amplifier and a power management sub-system. In combination, this reference platform presents a very competitive footprint, world-class power consumption and high levels of integration to provide a fast track to device development with reduced R&D effort and risks and an accelerated time to market. Its underlying modem technology provides one of the fastest throughputs available on the market and has been proven in approximately two billion handsets with most major operators and countries, ensuring a level of robustness and reliability that is unrivalled in the industry.

 

Its triple mode capabilities, which encompass LTE (4G), Dual Carrier HSPA (advanced 3G) and 2G cellular access technologies enable it to work on legacy networks around the world as well as the latest mobile broadband orientated systems. The modem platform enables many different implementations such as; a USB device designed to provide always on connectivity to the nomadic PC market, or a mini-PCIe format to be embedded in tablets, netbooks or similar devices. The platform also supports advanced smartphones when combined with powerful applications processors from Renesas Mobile or other companies. Furthermore, the low power consumption enables highly portable devices such as e-readers or gaming consoles to meet the challenging battery life demands of this type of application.

 

The prestigious Innovations Design and Engineering Awards are sponsored by the Consumer Electronics Association (CEA)®, the producer of the International CES, the world's largest consumer technology tradeshow, and have been recognizing achievements in product design and engineering since 1976. The Best of Innovations honor is awarded to the products with the highest judges' scores and will be featured in the Innovations Design and Engineering Showcase at the 2012 International CES.

 

Renesas Mobile's SP2531 will be demonstrated at the 2012 International CES, which runs January 10-13, 2012 in Las Vegas, Nevada. Honorees will also be displayed at CES Unveiled: the Official Press Event of the International CES from 4-7 p.m. on Sunday, January 8 in the Venetian Ballroom of the Venetian.

 

Products chosen as an Innovations honoree reflect innovative design and engineering of the entries. Examples may include the first time various technologies are combined in a single product or dramatic enhancements to previous product designs.

 

Innovations 2012 Design and Engineering honoree products are featured on www.CESweb.org/Innovations , which lists product categories, as well as each product name, manufacturer information, designer, description, photo and URL.

 

About Renesas Mobile Corporation

Renesas Mobile Corporation (RMC) is a wholly owned subsidiary of Renesas Electronics Corporation (TSE: 6723) and offers advanced and innovative products and services for mobile phones, car infotainment solutions, consumer electronics and industrial applications. Renesas Mobile's mission is to develop, productize and deliver communications centric semiconductor chipsets and complete hardware and software platforms built on these chipsets to meet the needs of our customers in these markets. Renesas Mobile provides complete cellular chipset platform solutions including powerful applications processors, leadership and industry reference cellular modems, highly integrated radio frequency devices and intelligent power management solutions. Renesas Mobile offers our customer complete system and software expertise to develop flagship devices more rapidly. 

 

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