The Intersil HS-6664RH is a radiation hardened 64K CMOS PROM, organized in an 8K word by 8-bit format. The chip is manufactured using a radiation hardened CMOS process, and utilizes synchronous circuit design techniques to achieve high-speed performance with very low power dissipation. On-chip address latches are provided, allowing easy interfacing with microprocessors that use a multiplexed address/data bus structure. The output enable control simplifies system interfacing by allowing output data bus control in addition to the chip enable control. All bits are manufactured storing a logical 0 and can be selectively programmed for a logical 1 at any bit location. Applications for the HS-6664RH CMOS PROM include low-power microprocessor-based instrumentation and communications systems, remote data acquisition and processing systems, and processor control storage. Specifications for Rad Hard QML devices are controlled by the Defense Supply Center in Columbus (DSCC). The SMD numbers listed here must be used when ordering. Detailed Electrical Specifications for these devices are contained in SMD 5962-95626.


  • Electrically screened to SMD # 5962-95626
  • QML qualified per MIL-PRF-38535 requirements
  • 1.2 micron radiation hardened bulk CMOS
  • Total dose 300 krad(Si) (Max)
  • Transient output upset >5 x 108 rad(Si)/s
  • LET >100 MEV-cm2/mg
  • Fast access time 35ns (Typ)
  • Single 5V power supply
  • Single pulse 10V field programmable
  • Synchronous operation
  • On-chip address latches
  • Three-state outputs
  • NiCr fuses
  • Low standby current <500µA (Pre-Rad)
  • Low operating current <15mA/MHz
  • Military temperature range -55 °C to 125 °C

Product Options

Part Number Part Status Pkg. Type Carrier Type DLA SMD Buy Sample
Active SBDIP Tube
Active SBDIP Tube 5962F9562601QXC
Active SBDIP Tube 5962F9562601VXC
Active CFP Tray
Active CFP Tray 5962F9562601QYC
Active CFP Tray 5962F9562601VYC

Documentation & Downloads

Title language Type Format File Size Date
Datasheets & Errata
HS-6664RH Datasheet Datasheet PDF 412 KB
Application Notes & White Papers
Wafer by Wafer Low Dose Rate Acceptance White Paper White Paper PDF 533 KB
AN9867: End of Life Derating: A Necessity or Overkill Application Note PDF 338 KB
HS-6664RH Full Radiation Characterization Report Application Note PDF 377 KB
PCN10123 - Alternate Die Attach Material for Assembly of Intersil Hermetic Packaged Products - Intersil Palm Bay, FL. (ISP) Product Change Notice PDF 230 KB
PCN08050B - AVLSI Technology Update - Consolidation of Wafer Fabrication and Backgrind Operations at the Intersil Palm Bay, Florida Facility Product Change Notice PDF 36 KB
Intersil Space Products Brochure Brochure PDF 3.14 MB
PIN19011 - Price Increase for the Listed Renesas Electronics America (REA) Radiation Hardened Space Products Price Increase Notice PDF 360 KB
PA18025 - Device Procurement Status Change - Active NCNR Product Advisory PDF 220 KB
Standard Microcircuit Drawing 5962-95626 (HS-6664RH, HS-6664RH-T) Other 0 KB
Intersil Commercial Lab Services Brochure PDF 364 KB
PA11003 - Packing Method Change for Intersil TO-xx Metal Can and Flat Pack Packaged Products Product Advisory PDF 499 KB

News & Additional Resources