The Intersil ISL84521, ISL84523, ISL84523 devices are CMOS, precision, quad analog switches designed to operate from a single +2V to +12V supply or from a ±2V to ±6V supply. Targeted applications include battery powered equipment that benefit from the devices' low power consumption (


  • Drop-in Replacements for MAX4521 - MAX4523
  • Four Separately Controlled SPST Switches
  • Pin Compatible with DG411, DG412, DG413
  • ON Resistance (RON Max.) 100Ω
  • RON Matching Between Channels <1Ω
  • Low Power Consumption (PD) <1µW
  • Low Leakage Current (Max at 85oC) 10nA
  • Fast Switching Action
  • tON 45ns
  • tOFF 15ns
  • Break before Make Timing
  • Minimum 2000V ESD Protection per Method 3015.7
  • TTL, CMOS Compatible


  • Battery Powered, Handheld, and Portable Equipment Cellular/Mobile Phones Pagers Laptops, Notebooks, Palmtops
  • Communications Systems Military Radios RF "Tee" Switches
  • Test Equipment Ultrasound Electrocardiograph
  • Heads-Up Displays
  • Audio and Video Switching
  • General Purpose Circuits +3V/+5V DACs and ADCs Digital Filters Operational Amplifier Gain Switching Networks High Frequency Analog Switching High Speed Multiplexing

Product Options

Part Number Part Status Pkg. Type Carrier Type MOQ Buy Sample
Active SOICN Tube 960
Active SOICN Reel 2500
Active TSSOP Tube 960
Active TSSOP Reel 2500

Documentation & Downloads

Title language Type Format File Size Date
Datasheets & Errata
ISL84521, ISL84522, ISL84523 Datasheet Datasheet PDF 776 KB
Application Notes & White Papers
AN535: Design Considerations for a Data Acquisition System (DAS) Application Note PDF 843 KB
PCN16043 - Alternate leadframe material for assembly of the listed Intersil TSSOP packaged products Product Change Notice PDF 78 KB
PCN13060 - Test Site Change for the Listed Intersil Products Product Change Notice PDF 223 KB
PCN12094 - Alternate Manufacturing Site for Assembly of the Listed Intersil Packaged Products - Amkor Technology, Philippines (ATP) Product Change Notice PDF 98 KB
PCN12085 - 8l, 14l, 16l SOIC w/ Gold Bond Wire @ ATP as Alternate Assembly Site Product Change Notice PDF 152 KB