The overall structure of the Renesas package code is as follows.

The overall structure of the Renesas package code

Table 1. Package Structure Codes

Code Description Code Description
C Ceramic (laminated ceramic) G Ceramic (glass sealed)
M Package consisting of metal P Package consisting of plastic
S Package using wafer process T Package consisting of tape
W Optical translucent package    

Table 2. Package Installation Height Codes

Code Description Code Description Code Description
R 1.70 < R L 1.20 < L <= 1.70 T 1.00 < T <= 1.20
V 0.80 < V <= 1.00 W 0.65 < W <= 0.80 U 0.50 < U <= 0.65
X X <= 0.50        

(Unit : mm)

Table 3. Package Appearance Codes

Code Appearance Code Appearance Code Appearance
BG BGA        
CA Card with connector CB No-contact card CC Card with surface-contact pin
DP DIP DT DTP    
LG LGA     PG PGA
QF QFF QJ QFJ QN QFN
QP QFP QT QTP QW QFI
SA TSOP (1) SB TSOP (2) SF SOF
SJ SOJ SN SON SP SOP
SS SIP SV SVP SW SOI
TP Asymmetric DTP        
ZP ZIP ZZ Special    

Table 4. Sample Pin Numbers

Display No. Pins Display No. Pins Display No. Pins Display No. Pins
0000 Contact-less 0008 8pin 0208 208pin 1848 1848pin

The number here does not always match the actual number of pins in case that some pins connected or depopulated.

Table 5. Pin Pitch Codes

Code Pin Pitch Code Pin Pitch Code Pin Pitch Code Pin Pitch Code Pin Pitch
A 2.54 B 1.778 C 1.50 D 1.27 E 1.25
F 1.00 G 0.80 H 0.75 J 0.65 K 0.50
L 0.40 M 0.30 Z Other than the above        

(Unit : mm)

Package Codes Example1

Package Codes Example2