The EK-RA6M3 evaluation kit enables users to seamlessly evaluate the features of the RA6M3 MCU Group and develop embedded systems applications using the Flexible Software Package (FSP) and e2studio IDE. Utilize rich on-board features along with your choice of popular ecosystem add-ons to bring your big ideas to life.
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Quick Start Guide
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Quick-Connect IoT PlatformQuick-Connect IoT platform enables fast prototyping by providing compatible hardware and software building blocks. | Other Hardware | Renesas |
Renesas Flash Programmer (Programming GUI)Flash memory programming software [Support MCU/MPU and devices: RA, RE, RX, RL78, RH850, Renesas Synergy, Power Management, Renesas USB Power Delivery Family, ICs for Motor Driver/Actuator Driver, V850, 78KR, 78K0] | Programmer (Unit/SW) | Renesas |
Flexible Software Package (FSP)FSP is an enhanced software package designed to provide easy-to-use, scalable, high-quality software for embedded system designs using Renesas RA Family of Arm Microcontrollers.
Note: FSP with e² studio Installer (Platform Installer) will install the e² studio tool, FSP packs, GCC toolchain and Segger J-Link drivers required to use this software. No additional installations are required.Downloads:
Securing Data at Rest Utilizing the Renesas Security MPUEK-RA6M3 Example Project BundleRA Azure IoT Cloud Connectivity SolutionGetting Started with Low Power Applications Package Application ProjectRA AWS MQTT/TLS Cloud Connectivity Solution Application Project
Getting Started with Low Power Applications Package for RA6M3 and RA4 Groups Application ProjectInjecting and Updating Secure User Keys for RA Family – Application ProjectRA6 Secure Bootloader Using MCUboot and Internal Code FlashGetting Started with PWM Output with Sub Nanosecond Delay Application for RA Family - Application ProjectRenesas RA Family Exception Handling - Application ProjectEK-RA6M3 Example Project Bundle
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Software Package | Renesas |
SEGGER™ J-Link™ Software and Documentation PackageSoftware utilities, firmware updates, and supporting documentation for the J-Link on-board programmer and debugger on the RA MCU kits. | Software Package | SEGGER |
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The Example Projects contained within the bundle show how to write code for the various Renesas Flexible Software
Package (FSP) modules supported by the EK-RA6M3 kit.
[Toolchains=GCC Arm Embedded|9.2.1.20191025] [Software=RA FSP|v1.0.0] [Board=EK-RA6M3] ZIP27.31 MB Related Files:
Compiler: GNU Arm Embedded IDE: e2 studio, Keil |
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MCUboot is a secure bootloader for 32-bit MCUs. It defines a common infrastructure for the bootloader,
defines system flash layout on microcontroller systems, and provides a secure bootloader that enables easy
software update
[Toolchains=GCC Arm Embedded|9.3.1.20200408] [Software=RA FSP|v4.2.0] [Board=EK-RA6M3;EK-RA6M4] ZIP29.00 MB Related Files:
Compiler: GNU Arm Embedded IDE: e2 studio |
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Sample Code |
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This application project discusses the considerations for securing Data at Rest in an embedded system and
provides guidelines on how to use the Security MPU hardware feature of the RA Family MCUs to implement
a secure Data at Rest solution. ZIP3.45 MB Related Files:
Compiler: ARMCC IDE: e2 studio |
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The application project uses the Flexible Software Package (FSP) of
the RA family|| the GNU GCC compiler|| and the integrated development environment e2 studio IDE to
demonstrate an exception handling flow for multiple possible faults. ZIP2.69 MB Related Files:
Compiler: GNU ARM Embedded IDE: e2 studio, Keil |
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The application example provided in the package uses AWS IoT Core. The detailed steps in this
document show first-time AWS IoT Core users how to configure the AWS IoT Core platform to run this
application example. ZIP4.89 MB Related Files:
IDE: e2 studio |
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Some typical applications for PWM with nanosecond delays are power supply control, motor control, inverter
control, battery charging, digital lightning control, and power factor correction (PFC). ZIP801 KB Related Files:
IDE: e2 studio |
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IDE: e2 studio |
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[Toolchains=GCC Arm Embedded|9.2.1.20191025] [Software=RA FSP|v1.0.0] [Board=EK-RA6M3] ZIP3.00 MB Related Files:
Compiler: GNU Arm Embedded IDE: e2 studio |
Sample Code |
Kickstart IoT and embedded systems development using Renesas EK-RA6M3, Evaluation Kit for RA6M3 MCU Group. Familiarize yourself with the kit architecture, key features, quick start example project and many useful resources to begin innovating quickly.
Renesas RA6 Series Innovation Kits for Connected IoT Applications | Blog Post | Apr 5, 2022 | |
Develop Faster Using Example Projects for RA MCU Innovation Kits for IoT | Blog Post | Dec 3, 2021 | |
Quickly Programming RA MCU Innovation Kits for IoT | Blog Post | Dec 3, 2021 | |
Accelerate Debugging Using RA MCU Innovation Kits for IoT Applications | Blog Post | Nov 15, 2021 | |
Beginning to Innovate Has Never Been Easier | Blog Post | Nov 11, 2021 |
The EK-RA6M3 meets the following certifications/standards. Refer to the EK-RA6M3 user manual for the disclaimer, precautions and more details on the certifications.
Renesas' Lab on the Cloud is an online environment where Renesas solutions, including popular evaluation boards, winning combinations and software, are hosted in a remote lab that customers access and test online.
This solution that consists of an RA6M3 MCU board with rich connectivity and multiple sensors allows data to be visualized through the Avnet IoTConnect platform's API.