DICEW (WAFER 0)

Title	Information
Package Description	DIE SALE (PRICE IN GOOD DIE)-WAFFLE PACK
Package Status	Active
Package Type	WAFER
Class	WAFER
Package Code	DICEW
Category	G
Lead Count	0
Pb (Lead) Free	Yes
Length	0mm
Pb Free Category	e3 Sn
Width	0mm
Thickness	0mm
Pitch	0mm
Package Carrier	WFP
Pkg. Dimensions (mm)	0.0 x 0.0 x 0.0

Documentation


Type	Title	Date
Package Outline Drawing	Bumped Die Outline Drawing Package Code: DICE Package Code: DICE DICEW 1.503 x 2.555 x 0.375 mm Body, 0.150mm Pitch PDF 696 KB	Mar 1, 2022
Package Outline Drawing	Bumped Die Outline Drawing Package Code: DICE DICEW 1.503 x 2.555 x 0.375 mm Body, 0.150mm Pitch PDF 716 KB	Mar 1, 2022
Package Outline Drawing	Bumped Die Outline Drawing Package Code: DICE DICEW 1.673 x 4.509 x 0.367 mm Body, 0.120mm Pitch PDF 988 KB	Jan 11, 2022
Package Outline Drawing	Bumped Die Outline Drawing Package Code: DICE DICEW 1.673 x 4.509 x 0.367 mm Body, 0.150mm Pitch PDF 886 KB	Jan 11, 2022
Package Outline Drawing	Bumped Die Outline Drawing 2.015 x 3.995 x 0.367 mm Body, 0.15mm Pitch DICEW PDF 762 KB	Dec 16, 2021
5 items