Currently, the development for autonomous driving has progressed and the number of connections between the instrument cluster and various sensors, information, and control devices are increasing. This is leading to an increasing amount of information being displayed on the instrument cluster to realize, including information on the vicinity of the car during driving. At the same time, from the point of view of safety, the need for increased visibility is increasing, and it is necessary to render graphics smoothly. Also, due to advances in LCD display technology, the trends towards larger sizes, higher resolution, and lower costs in automotive LCD displays are progressing. As a result, 3D clusters are becoming more widely used in the instrument cluster field.
Renesas has released the R-Car D3e automotive system SoC to address smooth rendering of high-quality 3D graphics and reduce development steps and costs, which are challenges for the development of entry-class 3D clusters.
Schematic symbols, PCB footprints, and 3D CAD models from SamacSys can be found by clicking on products in the Product Options table. If a symbol or model isn't available, it can be requested directly from the website.
|Item||R-Car D3e Specifications|
|Product No.||R-Car D3e (R8A779M7)|
|Power supply voltage||3.3/1.8 V(IO), 2.5V(Ether), 1.5V(DDR3)/1.35V(DDR3L), 1.03V(core)|
|Cache memory||L1 Instruction cache：32KB
L1 Operand cache：32KB
Data bus width：16bit x 1ch
|Graphics||3D Graphics Processing Unit
IMG PowerVR Series8XE GE8300
|2D Graphics Processing Unit|
|Video||Display Out x 2ch (LVDS x 2 or LVDS + Digital RGB)|
|Video Input x 1ch (Digital RGB)|
|Up and down scaling, color conversion, rotate, dithering, sharpness|
|Distortion compensation module (IMR-LSX4)|
|Video output check||Display Output Compare Unit (DISCOM)|
|Audio||Sampling rate converter x 2ch|
|Serial sound interface x 2ch|
|Storage interfaces||USB 2.0 host/function interface x 1 port (wPHY)|
|Multimedia card interface x 1ch|
|Raw NAND Flash memory interface x 1ch|
|In car network and
|Media local bus (MLB) Interface x 1ch (3-pin interface)|
|Controller area network (CAN-FD support) Interface x 2ch|
|Ethernet AVB 1.0-compatible MAC built in
Ethernet AVB (802.1BA)
|Security||Crypto engine (AES, DES, Hash, RSA)|
|Other peripherals||SYS-DMAC x 24ch, Realtime-DMAC x 8ch
Audio-DMAC x 16ch, Audio(peripheral)-DMAC x 4ch
|32bit timer x 26ch|
|PWM timer x 4ch|
|I2C bus interface x 4ch|
|Serial communication interface (SCIF) x 11ch|
|SPI Multi I/O Bus Controller (RPC) x 2ch (HyperFlash x 1ch support)|
|Clock-synchronized serial interface (MSIOF) x 4ch （SPI/IIS）|
|Low power mode||Module standby mode|
|DDR-SDRAM power supply backup mode|
|Package||401-pin FCBGA 0.8mm pitch (19mm x 19mm)|
|Development environment||ICE for Arm CPU available from tool vendors|
|Evaluation board||A user system development reference platform with the following features is also available to enable the users to carry out efficient system development.
(1) Incorporates car information system-oriented peripheral circuits, providing users with an actual device verification environment.
(2) Can be used as a software development tool for application software, etc.
(3) Allows easy implementation of custom user functions.
|Software Platform||Support OS: Linux, QNX® Neutrino® RTOS, Integrity® etc.|
(Remarks) Arm and Cortex are registered trademarks of Arm Limited PowerVR is a trademark of Imagination Technologies Limited. HyperFlash is a trademark of Cypress Semiconductor Corporation. QNX, neutrino and Blackberry are trademarks from BlackBerry Limited, and are used with permission from QNX Software System Limited. Green Hills Software and INTEGRITY are trademarks or registered trademarks of Green Hills Software, Inc. in the U.S. and/or internationally. All names of other products or services mentioned in this press release are trademarks or registered trademarks of their respective owners.