The 71V25761 3.3V CMOS Synchronous SRAM is organized as 128K x 36 and contains write, data, address and control registers. The burst mode feature offers the highest level of performance to the system designer, as the 71V25761 can provide four cycles of data for a single address presented to the SRAM.

特長

  • High system speed 200MHz (3.1ns clock access time)
  • LBO input selects interleaved or linear burst mode
  • Self-timed write cycle with global write control (GW), byte write enable (BWE), and byte writes (BWx)
  • 3.3V core power supply
  • Power down controlled by ZZ input
  • 2.5V I/O
  • Optional - Boundary Scan JTAG Interface (IEEE 1149.1 Compliant)
  • Available in 100-pin TQFP and 119-pin BGA packages

製品選択

製品名 Part Status Pkg. Type Lead Count (#) Temp. Grade Pb (Lead) Free Carrier Type 購入/サンプル
71V25761S166PFG
Active TQFP 100 C はい Tray
Availability
71V25761S166PFG8
Active TQFP 100 C はい Reel
Availability
71V25761S183PFG
Active TQFP 100 C はい Tray
Availability
71V25761S183PFG8
Active TQFP 100 C はい Reel
Availability
71V25761S183PFGI
Active TQFP 100 I はい Tray
Availability
71V25761S183PFGI8
Active TQFP 100 I はい Reel
Availability
71V25761S200PFG
Active TQFP 100 C はい Tray
Availability
71V25761S200PFG8
Active TQFP 100 C はい Reel
Availability
71V25761S200PFGI
Active TQFP 100 I はい Tray
Availability
71V25761S200PFGI8
Active TQFP 100 I はい Reel
Availability

ドキュメント&ダウンロード

タイトル language 分類 形式 サイズ 日付
データシート
71V25761 Datasheet データシート PDF 177 KB
PCN / PDN
PCN# : A1606-02 Add Greatek Taiwan as Alternate Assembly 製品変更通知 PDF 567 KB
PCN#: A1309-03 Additional Assembly Sources 製品変更通知 PDF 398 KB
PCN#: A-0410-02, Change IDT marking logo with new IDT gridless w 製品変更通知 PDF 24 KB
PDN# : SR-08-03R1 PRODUCT DISCONTINUANCE NOTICE ON SELECTIVE SPO PRODUCTS 製品抹消通知 PDF 254 KB
PCN# : A0706-04 MSL LEVEL 4 TO MSL LEVEL 3 FOR SELECTIVE TQFP-100 DEVICES 製品変更通知 PDF 101 KB
PCN#: A-0611-02 Transfer of Assembly Build for PBGA 119 (Green & Standard) from ATK, Korea to ATP, Philippines 製品変更通知 PDF 120 KB
PCN# A-0607-05 Green Mold Compound KMC3580 for BGA 製品変更通知 PDF 194 KB
A-0603-04 Transfer TQFP and PQFP from ASAT HK to ASAT China 製品変更通知 PDF 164 KB
PCN#: TB-0512-01 Reel Color Changed from Blue to Black 製品変更通知 PDF 729 KB
PCN # SR-0505-02 FPBGA BQ165 Solder Pad Opening/Ball Diameter 製品変更通知 PDF 163 KB
PCN A-0506-03; Packing Material Change 製品変更通知 PDF 290 KB
PCN#: A-0412-04 - To comply with Pb-free labels - Green Products 製品変更通知 PDF 80 KB
PCN#: A-0403-03, BGA package family 製品変更通知 PDF 38 KB
PCN#: A-0309-05, new m/c-G770 & d/a-2300 material 製品変更通知 PDF 211 KB
PCN#: A-0310-01, Green Products 製品変更通知 PDF 26 KB
PCN#:G-0303-01, new m/c G700 & 3230 d/a material 製品変更通知 PDF 138 KB
PCN# G-0206-08, Orientation of square PQFP & TQFP 製品変更通知 PDF 150 KB
PCN# G-0110-06 REV.1 Mold Compound 製品変更通知 PDF 48 KB
PCN SR0201-01 Die rev,Z(cemos 10) to Y (cemos11.5) 製品変更通知 PDF 22 KB
PCN# G-0110-06 Mold Compound 製品変更通知 PDF 47 KB
PCN# G9911-05, To qualify low alpha mold compound. 製品変更通知 PDF 44 KB
ダウンロード
71V25761_BG IBIS Model モデル-IBIS ZIP 9 KB
71V25761_PF IBIS Model モデル-IBIS ZIP 9 KB
71V25761 Verilog Model モデル-Verilog TAR 61 KB