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Uniquely suited for simple battery-operated sensing applications that require low power operation modes and fast wake-up times, the S124 MCU Group has 128 KB of flash memory and 16 KB of SRAM. It includes a 14-bit A/D Converter, 12-bit D/A Converter, and a Capacitive Touch Sensing Unit, in addition to safety and security features.

Synergy Software Package (SSP)

Commercial software worth over $100K which is available to developers using the Synergy Platform for no charge and with unlimited production license rights. The production-ready SSP is fully tested, maintained, and supported by Renesas.

Download SSP

Features

  • 32 MHz Arm® Cortex®-M0+ CPU
  • For battery-operated sensing applications that require low power operation modes and fast wake-up times
  • 14-bit A/D Converter, 12-bit D/A Converter
  • Capacitive Touch Sensing Unit
  • Safety and security features.

Applications

  • Wireless Motion Detector

descriptionDocumentation

Title language Type Format File Size Date
Datasheets & Errata
S124 Microcontroller Group Datasheet Datasheet PDF 1.71 MB
User Guides & Manuals
star S124 Microcontroller Group User's Manual 日本語 Manual - Hardware PDF 12.38 MB
Technical Updates
S124 MCU Group, S7G2 MCU Group, Note on ALeRASE command Technical Update PDF 104 KB
Errata for User's Manual: Hardware for HOCO (TN-SY-A0053A/E) Technical Update PDF 116 KB
How to access data flash without using device driver Technical Update PDF 156 KB
Application Notes & White Papers
Capacitive Sensor Microcontrollers CTSU Capacitive Touch Electrode Design Guide 日本語 Application Note PDF 2.72 MB
Renesas Synergy™ Platform Pin Configurator Usage 日本語 Application Note PDF 2.27 MB
Creating a Custom Board Support Package for SSP v1.2.0 or Later - Application Note 日本語 Application Note PDF 1.62 MB
USBX™ Device Class HID Module Guide - Application Project
Related Files: Sample Code
日本語 Application Note PDF 284 KB
Flash HAL Module Guide - Application Project
Related Files: Sample Code
日本語 Application Note PDF 409 KB
AE-CAP1 Out-of-Box Demonstration Programming Guidelines - Application Project
Related Files: Sample Code
日本語 Application Note PDF 1016 KB
Software Quality Summary for SSP v1.5.0 - Application Note 日本語 Application Note PDF 772 KB
Other
Industrial Automation Brochure 日本語, 简体中文 Brochure PDF 7.93 MB
Renesas Synergy™ Platform Brochure Brochure PDF 3.08 MB
Semiconductor Package Mount Manual 日本語, 简体中文 Other PDF 10.28 MB
Semiconductor Reliability Handbook 日本語 General Reliability Literature PDF 14.70 MB

file_downloadDownloads

Title language Type Format File Size Date
Sample Code
USBX™ Device Class HID Module Guide - Application Project Rev.1.04 - Sample Code Sample Code ZIP 2.25 MB
- USBX™ Device Class HID Module Guide - Application Project 日本語 Application Note PDF 284 KB
Flash HAL Module Guide - Application Project Rev.1.20 - Sample Code Sample Code ZIP 2.08 MB
- Flash HAL Module Guide - Application Project 日本語 Application Note PDF 409 KB
AE-CAP1 Out-of-Box Demonstration Programming Guidelines - Application Project Rev.1.03 - Sample Code Sample Code ZIP 37.11 MB
- AE-CAP1 Out-of-Box Demonstration Programming Guidelines - Application Project 日本語 Application Note PDF 1016 KB
USBX™ Device Class Mass Storage Module Guide - Application Project (r11an0104eu0104) Rev.1.04 - Sample Code Sample Code ZIP 2.22 MB
- USBX™ Device Class Mass Storage Module Guide - Application Project Application Note PDF 224 KB
Low-Power Modes and Mode Transitions on the DK-S124 - Application Project Rev.1.25 - Sample Code Sample Code ZIP 3.33 MB
- Low-Power Modes and Mode Transitions on the DK-S124 - Application Project Application Note PDF 1.93 MB
DK-S124 Simple Record/Playback - Application Project Rev.1.16 - Sample Code Sample Code ZIP 2.43 MB
- DK-S124 Simple Record/Playback - Application Project Application Note PDF 848 KB
Simple Audio Playback Example for DK-S124 - Application Project Rev.1.06 - Sample Code Sample Code ZIP 2.13 MB
- Simple Audio Playback Example for DK-S124 - Application Project Application Note PDF 329 KB
DK-S124 Out-of-Box Programming Guide - Application Project Rev.1.16 - Sample Code Sample Code ZIP 6.76 MB
- DK-S124 Out-of-Box Programming Guide - Application Project 日本語 Application Note PDF 576 KB
CTSU Slider Example on DK-S124 - Application Project Rev.1.15 - Sample Code Sample Code ZIP 4.28 MB
- CTSU Slider Example on DK-S124 - Application Project 日本語 Application Note PDF 2.57 MB
Simple PMOD Display Application Example for DK-S124 - Application Project Rev.1.06 - Sample Code Sample Code ZIP 2.46 MB
- Simple PMOD Display Application Example for DK-S124 - Application Project Application Note PDF 755 KB
USBX™ Device Class CDC-ACM Module Guide - Application Project Rev.1.01 - Sample Code Sample Code ZIP 4.86 MB
- USBX™ Device Class CDC-ACM Module Guide - Application Project Application Note PDF 456 KB

select_allSoftware & Tool Pages

Title Type Description Company
Renesas Synergy™ Software Package (SSP) Software Package Tightly integrated, optimized, and qualified suite of software with a commercial RTOS that scales with end-product complexity and simplifies complex system-level services. Renesas
e² studio IDE and Coding Tool Eclipse-based Renesas integrated development environment (IDE).
[Support MCU/MPU: RA, RE, RX, RL78, RH850, Renesas Synergy, RZ]
(Note: You need to install compiler separately as an additional software)
(Note: No separate e² studio installation required for RA FSP, this will be installed as part of the FSP with e² studio installer (Platform Installer) on GitHub.)
Renesas
QE for Capacitive Touch: Development Assistance Tool for Capacitive Touch Sensors Solution Toolkit In developing embedded system using the capacitive touch sensor of RA family and RX family MCUs, you can easily setup initial configurations of the touch interface as well as process the tuning of sensors, and reduce development time. [Plugin for Renesas IDE "e2 studio"]
Renesas

memoryBoards & Kits

Part Number Title Type Company
YSAECAP1S11 AE-CAP1 - Capacitive Touch Application Evaluation Renesas
YSDKS124S20 DK-S124 Development Kit Development Renesas

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