The ISL6261A is a single-phase buck regulator implementing lntel® IMVP-6® protocol, with embedded gate drivers. lntel® Mobile Voltage Positioning (IMVP) is a smart voltage regulation technology effectively reducing power dissipation in lntel® Pentium processors. The heart of the ISL6261A is the patented R3 Technology™, Intersil's Robust Ripple Regulator modulator. Compared with the traditional multi-phase buck regulator, the R3 Technology™ has faster transient response. This is due to the R3 modulator commanding variable switching frequency during a load transient. The ISL6261A provides three operation modes: the Continuous Conduction Mode (CCM), the Diode Emulation Mode (DEM) and the Enhanced Diode Emulation Mode (EDEM). To boost battery life, the ISL6261A changes its operation mode based on CPU mode signals DPRSLRVR and DPRSTP#, and the FDE pin setting, to maximize the efficiency. In CPU active mode, the ISL6261A commands the CCM operation. When the CPU enters deeper sleep mode, the ISL6261A enables the DEM to maximize the efficiency at light load. Asserting the FDE pin of the ISL6261A in CPU deeper sleep mode will enable the EDEM to further decrease the switching frequency at light load and increase the regulator efficiency. A 7-bit Digital-to-Analog Converter (DAC) allows dynamic adjustment of the core output voltage from 0. 300V to 1. 500V. The ISL6261A has 0. 5% system voltage accuracy over temperature. A unity-gain differential amplifier provides remote voltage sensing at the CPU die. This allows the voltage on the CPU die to be accurately measured and regulated per lntel® IMVP-6 specification. Current sensing can be implemented through either lossless inductor DCR sensing or precise resistor sensing. If DCR sensing is used, an NTC thermistor network will thermally compensates the gain and the time constant variations caused by the inductor DCR change. The ISL6261A provides the power monitor function through the PMON pin. PMON output is a high-bandwidth analog voltage signal representing the CPU instantaneous power. The power monitor function can be used by the system to optimize the overall power consumption, extending battery run time.

Features

  • Precision single-phase CORE voltage regulator
  • 0.5% system accuracy over temperature
  • Enhanced load line accuracy
  • Internal gate driver with 2A driving capability
  • Microprocessor voltage identification input
  • 7-Bit VID input
  • 0.300V to 1.500V in 12.5mV steps
  • Support VID change on-the-fly
  • Multiple current sensing schemes supported
  • Lossless inductor DCR current sensing
  • Precision resistive current sensing
  • Thermal monitor
  • Power monitor indicating CPU instantaneous power
  • User programmable switching frequency
  • Differential remote voltage sensing at CPU die
  • Overvoltage, undervoltage, and overcurrent protection
  • Pb-free (RoHS compliant)

Product Options

Part Number Part Status Pkg. Type Carrier Type MOQ Buy Sample
Active QFN Tube 50
Availability
Active QFN Reel 4000
Availability
Active QFN Tube 50
Availability
Active QFN Reel 4000
Availability

Documentation

Title language Type Format File Size Date
Datasheets & Errata
ISL6261A Datasheet Datasheet PDF 2.08 MB
Application Notes & White Papers
AN1681: Grounding Techniques Application Note PDF 509 KB
AN1684: Nonideality of Ground Application Note PDF 397 KB
Five Easy Steps to Create a Multi-Load Power Solution White Paper PDF 846 KB
PCNs & PDNs
PCN20029A - Alternate bond wire material and assembly facility of the listed Renesas QFN packaged products Product Change Notice PDF 327 KB
PCN14036 - Wafer fabrication Site Change for Listed Intersil Products - Palm Bay, Florida Product Change Notice PDF 294 KB
PCN13025B - Alternate Bond Wire Material and Manufacturing Facilities for Assembly of the Listed Intersil DFN/QFN Packaged Products Product Change Notice PDF 222 KB
PCN13025 - Alternate Bond Wire Material and Manufacturing Facilities for Assembly of the Listed Intersil DFN/QFN Packaged Products - Advanced Semiconductor Engineering (ASECL) - Chung-Li , Taiwan and STATS ChipPAC (SCM) - Kuala Lumpur, Mal Product Change Notice PDF 106 KB
PCN13009 - Alternate Bond Wire Material and Manufacturing Facilities for Assembly of the Listed Intersil DFN/QFN Packaged Products - Advanced Semiconductor Engineering (ASECL) - Chung-Li (ASECL), Taiwan and STATS ChipPAC (SCM) - Kuala Lump Product Change Notice PDF 173 KB
PCN10083 - Alternate Bond Wire Material for Assembly of the Listed Intersil DFN/QFN Packaged Products - STATS ChipPAC Malaysia Product Change Notice PDF 79 KB
PCN10055 - Alternate Bond Wire Material for Assembly of the Listed Intersil DFN/QFN Packaged Products - STATS ChipPAC Malaysia Product Change Notice PDF 248 KB
Other
Industrial Power Management Brochure ( R16CL0001EJ0200 ) 日本語 Brochure PDF 3.13 MB