Overview

Description

The R8C/1A Group is supported only for customers who have already adopted these products. The RL78/G12 Group is recommended for new designs.

These MCUs are fabricated using a high-performance silicon gate CMOS process, embedding the R8C/Tiny Series CPU core, and is packaged in a 20-pin molded-plastic LSSOP, SDIP or a 28-pin plastic molded-HWQFN. It implements sophisticated instructions for a high level of instruction efficiency. With 1Mb of address space, they are capable of executing instructions at high speed. Furthermore, the R8C/19 Group has on-chip data flash ROM (1KB × 2 blocks). The difference between the R8C/18 Group and R8C/19 Group is only the presence or absence of data flash ROM. Their peripheral functions are the same.

Applications

Applications

  • Electric Household Appliances
  • Office Equipment
  • Housing Equipment (Sensors / Security)
  • General Industrial Equipment
  • Audio Equipment

Documentation

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Datasheet
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Brochure
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Brochure
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Brochure
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General Reliability Literature
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Guide
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Guide
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Guide
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Guide
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Guide
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Manual - Development Tools
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Manual - Development Tools
Manual - Hardware
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PDF4.86 MB日本語
Product Change Notice
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Quick Start Guide
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Release Note
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Technical Update
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Tool News - Note
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