The CD4000BMS (dual 3 plus inverter), CD4001BMS (quad 2-input), CD4002BMS (dual 4-input), and CD4025BMS (triple 3-input) NOR gates provide the system designer with direct implementation of the NOR function and supplement the existing family of CMOS gates. All inputs and outputs are buffered. The CD4000BMS, CD4001BMS, CD4002BMS, and the CD4025BMS are supplied in these 14-lead outline packages: Braze Seal DIP H4X and H4Q, Frit Seal DIP H1B, and Ceramic Flatpack H3W.


  • High-voltage types (20V rating)
  • Propagation delay time = 60ns (typ.) at CL = 50pF, VDD = 10V
  • Buffered inputs and outputs
  • Standard symmetrical output characteristics
  • 100% tested for maximum quiescent current at 20V
  • 5V, 10V and 15V parametric ratings
  • Maximum input current of 1µA at 18V over full package temperature range; 100nA at 18V and +25 °C
  • Noise margin (over full package temperature range):
    • 1V at VDD = 5V
    • 2V at VDD = 10V
    • 2.5V at VDD = 15V
  • Meets all requirements of JEDEC tentative standards No. 13B, "Standard Specifications for Description of "B" Series CMOS devices

Product Options

Part Number Part Status Pkg. Type Carrier Type DLA SMD Buy Sample
Active SBDIP Tube 5962R9582604VCC
Active CFP Tray 5962R9582604VXC

Documentation & Downloads

Title language Type Format File Size Date
Datasheets & Errata
CD4000BMS, CD4001BMS, CD4002BMS, CD4025BMS Datasheet Datasheet PDF 404 KB
Application Notes & White Papers
Wafer by Wafer Low Dose Rate Acceptance White Paper White Paper PDF 533 KB
AN9867: End of Life Derating: A Necessity or Overkill Application Note PDF 338 KB
AN9654: Use of Life Tested Parts Application Note PDF 224 KB
PCN10123 - Alternate Die Attach Material for Assembly of Intersil Hermetic Packaged Products - Intersil Palm Bay, FL. (ISP) Product Change Notice PDF 230 KB
Intersil Space Products Brochure Brochure PDF 3.14 MB
PIN19011 - Price Increase for the Listed Renesas Electronics America (REA) Radiation Hardened Space Products Price Increase Notice PDF 360 KB
Intersil Commercial Lab Services Brochure PDF 364 KB
PA11003 - Packing Method Change for Intersil TO-xx Metal Can and Flat Pack Packaged Products Product Advisory PDF 499 KB

News & Additional Resources