The ISL97701 represents a high efficiency boost converter with integrated boost FET, boost diode and input disconnect FET. With an input voltage of 2. 3V to 5. 5V the ISL97701 has an output capability of up to 50mA at 18V using integrated 500mA switches. Efficiencies are up to 87%. The integrated protection FET is used to disconnect the boost inductor from the input supply whenever an output fault condition is detected, or when the device is disabled. This gives 0 output current in the disabled mode, compared to standard boost converters where current can still flow when the device is disabled. The ISL97701 comes in the 10 Ld 3x3 DFN package and is specified for operation over the -40°C to +85°C temperature range.

Features

  • Up to 87% efficiency
  • 2.3V to 5.5V input
  • Up to 28V output
  • 50mA at 18V
  • Integrated boost Schottky diode
  • Input voltage disconnect switch
  • Synchronization input
  • Chip enable
  • 10 Ld 3x3 DFN package
  • Pb-free (RoHS compliant)

Applications

  • OLED display power
  • LED display power
  • Adjustable power supplies

Product Options

Part Number Part Status Pkg. Type Carrier Type MOQ Buy Sample
Active DFN Tube 100
Availability
Active DFN Reel 2500
Availability
Active DFN Reel 1000
Availability

Documentation

Title language Type Format File Size Date
Datasheets & Errata
ISL97701 Datasheet Datasheet PDF 596 KB
Application Notes & White Papers
AN9208: High Frequency Power Converters Application Note PDF 592 KB
AN1673: Application Circuit to Generate Plus and Minus Supplies Using the ISL97701 Boost Regulator Application Note PDF 382 KB
AN1681: Grounding Techniques Application Note PDF 509 KB
AN1684: Nonideality of Ground Application Note PDF 397 KB
AN9210: A New Pspice Subcircuit For The Power MOSFET Featuring Global Temperature Options Application Note PDF 650 KB
AN9209: A Spice-2 Subcircuit Representation For Power MOSFETs Using Empirical Methods Application Note PDF 387 KB
AN7244: Understanding Power MOSFETs Application Note PDF 349 KB
Five Easy Steps to Create a Multi-Load Power Solution White Paper PDF 846 KB
PCNs & PDNs
PCN15046 - Wafer Fabrication Site Change for Listed Intersil Products - Global Foundry P6 Process transfer to Palm Bay - Phase II Product Change Notice PDF 398 KB
PCN13025 - Alternate Bond Wire Material and Manufacturing Facilities for Assembly of the Listed Intersil DFN/QFN Packaged Products - Advanced Semiconductor Engineering (ASECL) - Chung-Li , Taiwan and STATS ChipPAC (SCM) - Kuala Lumpur, Mal Product Change Notice PDF 106 KB
PCN13009 - Alternate Bond Wire Material and Manufacturing Facilities for Assembly of the Listed Intersil DFN/QFN Packaged Products - Advanced Semiconductor Engineering (ASECL) - Chung-Li (ASECL), Taiwan and STATS ChipPAC (SCM) - Kuala Lump Product Change Notice PDF 173 KB
PCN10055 - Alternate Bond Wire Material for Assembly of the Listed Intersil DFN/QFN Packaged Products - STATS ChipPAC Malaysia Product Change Notice PDF 248 KB
Other
PA14042 - Minimum Line Quantity Change Product Advisory PDF 363 KB