July 28, 2014

TOKYO, Japan, July 28, 2014 — Renesas Electronics Corporation (TSE: 6723, “Renesas Electronics”), a premier provider of advanced semiconductor solutions, today announced that, under the approval of Renesas Electronics' Board of Directors on July 28, 2014, it will consolidate its subsidiary Renesas Mobile Corporation (“Renesas Mobile”) through an absorption-type merger (“Merger”).

Since the Merger is an absorption-type merger of a wholly-owned subsidiary, certain disclosure items and details have been omitted.

1. Purpose of Merger

Renesas Mobile was established in 2010 as a wholly-owned subsidiary of Renesas Electronics that is principally engaged in the design of system-on-chip (SoC) devices for use in mobile phones and car information systems (CIS). However, as announced on March 12, 2013, Renesas Electronics has been considering a variety of structural reform measures for the mobile business of Renesas Mobile, and has implemented measures to withdraw from the 4G wireless business.

As an important initiative among the structural reform measures currently being undertaken by the company, Renesas Electronics has decided to execute an absorption-type merger with Renesas Mobile with an aim of expanding its CIS business in the automotive field, by concentrating resources involved in that business within Renesas Electronics and to improve the company's ability to develop solutions, while boosting the operational efficiency of that business and strengthening the profit structure.

2. Summary of Merger

(1) Schedule of Merger

  • Approval of Board of Directors regarding debt waiver to consolidated subsidiary: July 28, 2014
  • Approval of Board of Directors regarding the Merger: July 28, 2014
  • Conclusion of merger agreement: July 28, 2014
  • Date of Merger (effective date): October 1, 2014 (planned)

(Note) Renesas Electronics will follow the procedure for a simple absorption-type merger as stipulated under Article 796, §3 of the Japan Corporation Law, and Renesas Mobile will follow the procedure for a short-form absorption-type merger as stipulated in Article 784, §1 of the Japan Corporation Law, both of which do not require approval of the merger agreement by a general meeting of shareholders.

(2) Method of Merger

The Merger will be conducted through an absorption-type merger method in which Renesas Electronics will be the surviving company and Renesas Mobile will be dissolved as the absorbed company.

Since Renesas Mobile presently has liabilities exceeding its assets, Renesas Electronics plans to waive the debts owed by Renesas Mobile in advance of the merger, thereby eliminating its state of insolvency before the merger takes place.

  • Debts to be waived: Loans and other accounts receivable
  • Total value of debts to be waived: 38.9 billion yen (estimate)
  • Implementation date: September 30, 2014 (planned)

(3) Distribution of Assets

Since Renesas Mobile is a wholly-owned subsidiary of Renesas Electronics, there will be no stocks, money, etc. issued in connection with the Merger

(4) Share subscription rights and bonds with share subscription rights

No share subscription rights or bonds with share subscription rights are issued.

3. Overview of parties to the Merger (as of March 31, 2014)

Company Name Renesas Electronics Corporation (surviving company) Renesas Mobile Corporation (absorbed company)
(1) Address 1753 Shimonumabe, Nakahara-ku, Kawasaki, Kanagawa Nippon Building, 2-6-2, Ote-machi, Chiyoda-ku, Tokyo
(2) Representative Hisao Sakuta, Representative Director, Chairman and CEO Hideaki Chaki, CEO
(3) Major Operations Research, development, design, manufacture, sale, and servicing of semiconductor products Design of SoC devices, etc., for use primarily in mobile phones and car information systems
(4) Capital 228,255 million yen 5,000 million yen
(5) Established November 1, 2002 (started operation on April 1, 2010) September 1, 2010 (started operation on December 1, 2010)
(6) Major Stockholders and Ownership Ratios Innovation Network Corporation of Japan: 69.15%
Japan Trustee Services Bank, Ltd. (Re-trust of Sumitomo Mitsui Trust Bank, Limited / NEC Corporation pension and severance payments Trust Account): 8.11%
Hitachi, Ltd.: 7.66%
Mitsubishi Electric Corporation: 6.26%
Renesas Electronics Corporation: 100%
(7) Shares Issued 1,667,124,490 100,000
(8) Fiscal Term March 31 March 31
(9) Consolidated Net Assets 227,314 million yen -40,915 million yen
(10) Consolidated Net Assets per Share 128.73 yen -409,151.60 yen
(11) Consolidated Total Assets 786,002 million yen 7,377 million yen
(12) Consolidated Net Sales 833,011 million yen 45,779 million yen
(13) Consolidated Operating Income (Loss) 67,635 million yen -4.250 million yen
(14) Consolidated Ordinary Income (Loss) 58,625 million yen -5,699 million yen
(15) Consolidated Net Income (Loss) -5,291 million yen -4,282 million yen
(16) Consolidated NetIncome (Loss)per Share -5.07 yen -42,818.43 yen

Note: Figures for Renesas Mobile listed above are not consolidated results as Renesas Mobile does not prepare its own consolidated financial statement.

4. Situation Following the Merger

There will be no changes to the company name, business activities, headquarters address, representative, capital, and end of fiscal year of Renesas Electronics as a result of the merger.

5. Future Outlook

No major impact is anticipated on Renesas Electronics' consolidated and non-consolidated financial results for the fiscal year ending March 31, 2015 as a result of the Merger

About Renesas Electronics Corporation

Renesas Electronics Corporation (TSE: 6723) delivers trusted embedded design innovation with complete semiconductor solutions that enable billions of connected, intelligent devices to enhance the way people work and live. A global leader in microcontrollers, analog, power and SoC products, Renesas provides comprehensive solutions for a broad range of automotive, industrial, infrastructure, and IoT applications that help shape a limitless future. Learn more at renesas.com. Follow us on LinkedIn, Facebook, Twitter, and YouTube.

The content in the press release, including, but not limited to, product prices and specifications, is based on the information as of the date indicated on the document, but may be subject to change without prior notice.

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