UPDATE 3- Regarding the Impact of the March 11 Earthquake on Renesas Electronics Operations and Its Response to the Blackouts

16 Mar 2011

TOKYO, Japan, March 16, 2011 — Renesas Electronics Corporation (TSE: 6723) has announced the impact of the earthquake in northern Japan on March 11, on Renesas Electronics Group (“the Group”) manufacturing sites and its response to the planned blackouts implemented by Tokyo Electric Power Company and Tohoku Electric Power Company. The Group intends to add details of the impact from the earthquake to its financials when confirmed information is available.

 

As of March 16, 12:00p.m., following seven factories out of 22 of the Group's factories in Japan have been temporarily shutting their production.

 

[Status of Renesas Electronics Group's factories (as of March 16, 2011, 12:00 p.m)]

Factory City/ Prefecture Building Manufacturing Equipment Operational Status and Status of Electric Power Supply Status of the investigation
1 Renesas Northern Japan Semiconductor, Inc., Tsugaru Factory (Front-end line) Goshogawara-shi, Aomori Partial damage confirmed Currently assessing the status Currently assessing the status, Remain without electricity Assessment of manufacturing equipment to begin after electricity is restored
2 Renesas Yamagata Semiconductor Co., Ltd., Tsuruoka Factory (Front-end line) Tsuruoka-shi, Yamagata No damage confirmed No damage confirmed Halting startup procedure temporarily, Subject to the planned blackout Preparing to halt the startup procedure temporarily in response to the planned blackout
3 Renesas Electronics Corporation, Naka Factory (Front-end line) Hitachinaka-shi, Ibaraki Defect identified (Assessing the extent of the damage) Defect identified (Assessing the extent of the damage) Temporarily shutting production, Remain without electricity. Plan to assess the status of inside the clean room after electricity is restored
4 Renesas Electronics Corporation, Takasaki Factory (Front-end line) Takasaki-shi, Gunma Partial damage confirmed No damage confirmed Preparing to begin startup procedures to restart its manufacturing, Subject to the planned blackout Plan to begin startup procedures to restart its manufacturing after the planned
5 Renesas Electronics Corporation, Kofu Factory (Front-end line) Kai-shi, Yamanashi Partial damage confirmed Partial damage confirmed Preparing to begin startup procedures to restart its manufacturing, Subject to the planned blackout Plan to begin startup procedures to restart its manufacturing after the planned blackout is terminated
6 Renesas High Components, Inc. (Back-end line) Tsuruta-cho, Aomori No damage confirmed No damage confirmed Preparing to begin startup procedures to restart its manufacturing, Subject to the planned blackout Plan to begin startup procedures to restart its manufacturing after the planned blackout is terminated
7 Renesas Northern Japan Semiconductor, Inc., Yonezawa Factory (Back-end line) Yonezawa-shi, Yamagata Partial damage confirmed Partial damage confirmed Began startup procedures to restart its manufacturing, Subject to the planned blackout Proceed with the startup procedures to restart its manufacturing when the planned blackout is not implemented
8 Renesas Eastern Japan Semiconductor, Tokyo Device Division (Back-end line) Oume-shi, Tokyo No damage confirmed No damage confirmed Restarted part of its manufacturing Restarted its manufacturing during the time when the planned blackout is not implemented, however, only for those products that had been in progress
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