The ISL33003 two-channel bus buffer provides the buffering necessary to extend the bus capacitance beyond the 400pF maximum specified by the I2C specification. In addition, the ISL33003 features rise time accelerator circuitry to reduce power consumption from passive bus pull-up resistors and improve data-rate performance. The device also includes hot-swap circuitry to prevent corruption of the data and clock lines when I2C devices are plugged into a live backplane, and the ISL33003 adds level translation for mixed supply voltage applications. The ISL33003 operates at supply voltages from +2.3V to +5.5V at a temperature range of -40 °C to +85 °C.

Features

  • Two-channel I2C compatible bidirectional buffer
  • +2.3VDC to +5.5VDC supply range
  • >400kHz operation
  • Bus capacitance buffering
  • Rise time accelerators
  • Hot swapping capability
  • ±6kV Class 3 HBM ESD protection on all pins
  • ±12kV HBM ESD protection on SDA/SCL pins
  • Enable pin
  • Logic level translation
  • Pb-free (RoHS compliant) 8 Ld TDFN (3mm x 3mm) and 8 Ld MSOP packages
  • Low quiescent current: 2.1mA typ
  • Low shutdown current: 0.5µA typ

Applications

  • I2C bus extender and capacitance buffering
  • Server racks for telecom, datacom, and computer servers
  • Desktop computers
  • Hot-swap board insertion and bus isolation

tuneProduct Options

Part Number Part Status Pkg. Type Carrier Type MOQ Buy Sample
Last Time Buy TDFN Tube 100
Availability
Last Time Buy TDFN Reel 6000
Availability
Last Time Buy TDFN Tube 100
Availability
Last Time Buy TDFN Reel 6000
Availability
Active MSOP Tube 50
Availability
Active MSOP Reel 2500
Availability

descriptionDocumentation

Title language Type Format File Size Date
Datasheets & Errata
star ISL33001, ISL33002, ISL33003 Datasheet Datasheet PDF 1.01 MB
Application Notes & White Papers
AN1637: Level Shifting Down to 1.8V Using 3.3V I2C Buffers Application Note PDF 303 KB
PCNs & PDNs
PCN21016 - Correction of Moisture Sensitivity Level and Alternate bond wire material of the listed Renesas DFN, QFN, TDFN, TQFN packaged products Product Change Notice PDF 202 KB
PLC21035 - End of Life Notice Product Life Cycle Notice PDF 1.17 MB
PCN20029A - Alternate bond wire material and assembly facility of the listed Renesas QFN packaged products Product Change Notice PDF 327 KB
PA14042 - Minimum Line Quantity Change Product Advisory PDF 363 KB
PCN13025 - Alternate Bond Wire Material and Manufacturing Facilities for Assembly of the Listed Intersil DFN/QFN Packaged Products - Advanced Semiconductor Engineering (ASECL) - Chung-Li , Taiwan and STATS ChipPAC (SCM) - Kuala Lumpur, Mal Product Change Notice PDF 106 KB
PCN13009 - Alternate Bond Wire Material and Manufacturing Facilities for Assembly of the Listed Intersil DFN/QFN Packaged Products - Advanced Semiconductor Engineering (ASECL) - Chung-Li (ASECL), Taiwan and STATS ChipPAC (SCM) - Kuala Lump Product Change Notice PDF 173 KB
PCN13005 - Alternate Bond Wire Material for Assembly of the Listed Intersil DFN/QFN Packaged Products - Carsem (CAS) Ipoh, Malaysia Product Change Notice PDF 84 KB
PCN11059 - Shipping Tube Change for Intersil MSOP Packaged Products Product Change Notice PDF 117 KB
Other
Analog ICs Brochure 日本語 Brochure PDF 4.20 MB

memoryBoards & Kits

Part Number Title Type Company
ISL33003MSOPEVAL1Z I2C Bus Buffer with Rise Time Accelerators and Hot Swap Capability Evaluation Board Evaluation Renesas