The Intersil HD-15530 is a high performance CMOS device intended to service the requirements of MlL-STD-1553 and similar Manchester II encoded, time division multiplexed serial data protocols. This LSI chip is divided into two sections, an Encoder and a Decoder. These sections operate completely independent of each other, except for the Master Reset functions. This circuit meets many of the requirements of MIL-STD- 1553. The Encoder produces the sync pulse and the parity bit as well as the encoding of the data bits. The Decoder recognizes the sync pulse and identifies it as well as decoding the data bits and checking parity. This integrated circuit is fully guaranteed to support the 1MHz data rate of MlL-STD-1553 over both temperature and voltage. It interfaces with CMOS, TTL or N channel support circuitry, and uses a standard 5V supply. The HD-15530 can also be used in many party line digital data communications applications, such as an environmental control system driven from a single twisted pair cable of fiber optic cable throughout the building.

Features

  • Support of MlL-STD-1553
  • Data Rate 1.25 MBit/s
  • Sync Identification and Lock-In
  • Clock Recovery
  • Manchester II Encode, Decode
  • Separate Encode and Decode
  • Low Operating Power 50mW at 5V

tuneProduct Options

Part Number Part Status Pkg. Type Carrier Type Buy Sample
Active CLCC Tube
Availability
Active CERDIP Tube
Availability
Active CERDIP Tube
Availability

descriptionDocumentation

Title language Type Format File Size Date
Datasheets & Errata
star HD-15530 Datasheet Datasheet PDF 719 KB
Application Notes & White Papers
AN9867: End of Life Derating: A Necessity or Overkill Application Note PDF 338 KB
PCNs & PDNs
Unification of a JEDEC tray and a embossed carrier tape for LQFP package (Additional Information & Correction) 日本語 Product Change Notice PDF 4.86 MB
Unification of a JEDEC tray and a embossed carrier tape for LQFP package ( PC-WRP-A001B/E ) 日本語 Product Change Notice PDF 3.74 MB
PCN16087 - Alternate die attach material for assembly of Intersil hermetic packaged products Product Change Notice PDF 260 KB
Unification of a JEDEC tray and a embossed carrier tape for LQFP package ( PC-WRP-A001A/E ) 日本語 Product Change Notice PDF 1.46 MB
PCN15064 - Qualification of Alternate Assembly Site for CERDIP (MMT) Product Change Notice PDF 323 KB
PA14064 - Minimum Line Quantity Change Product Advisory PDF 282 KB
PCN14017 - Test Site Change for the Listed Intersil Products - Carsem (CAS) Ipoh, Malaysia Product Change Notice PDF 174 KB
PCN11039 - Manufacturing Site Change for Assembly of Intersil Ceramic Dual-In-Line (Frit Seal Cerdip) Products - Amkor (ATP) Muntinlupa City, Philippines Product Change Notice PDF 147 KB
PCN11040 - Manufacturing Site Change for Assembly of Intersil Ceramic Dual-In-Line (Frit Seal Cerdip) Products - Amkor (ATP) Muntinlupa City, Philippines Product Change Notice PDF 151 KB
PCN11042 - Manufacturing Site Change for Assembly of Intersil Ceramic Solder Seal Packaged Products - Amkor (ATP) Muntinlupa City, Philippines and Intersil (ISP) Palm Bay, FL Product Change Notice PDF 138 KB
Other
Intersil Space Products Brochure Brochure PDF 3.14 MB
Intersil Commercial Lab Services Brochure PDF 364 KB
Renesas General-Purpose ICs Power Management Linear ICs / General-Purpose Linear ICs / General-Purpose Logic ICs General Catalog Brochure PDF 5.23 MB
Renesas Semiconductor Lead-Free Packages Brochure PDF 1.32 MB