The ISL33001, ISL33002, ISL33003 are 2-Channel Bus Buffers that provide the buffering necessary to extend the bus capacitance beyond the 400pF maximum specified by the I2C specification. In addition, the ISL33001, ISL33002, ISL33003 feature rise time accelerator circuitry to reduce power consumption from passive bus pull-up resistors and improve data-rate performance. All devices also include hot swap circuitry to prevent corruption of the data and clock lines when I2C devices are plugged into a live backplane, and the ISL33002 and ISL33003 add level translation for mixed supply voltage applications. The ISL33001, ISL33002, ISL33003 operate at supply voltages from +2. 3V to +5. 5V at a temperature range of -40°C to +85°C.

Features

  • 2 Channel I2C compatible bi-directional buffer
  • +2.3VDC to +5.5VDC supply range
  • 400kHz operation
  • Bus capacitance buffering
  • Rise time accelerators
  • Hot swapping capability
  • ±6kV Class 3 HBM ESD protection on all pins
  • ±12kV HBM ESD protection on SDA/SCL pins
  • Enable pin (ISL33001 and ISL33003)
  • Logic level translation (ISL33002 and ISL33003)
  • READY logic pin (ISL33001)
  • Accelerator disable pin (ISL33002)
  • Pb-free (RoHS Compliant) 8 Ld SOIC (ISL33001 only), 8 Ld TDFN (3mmx3mm) and 8 Ld MSOP packages
  • Low quiescent current: 2.1mA typ
  • Low shutdown current: 0.5µA typ

Applications

  • I2C bus extender and capacitance buffering
  • Server racks for telecom, datacom, and computer servers
  • Desktop computers
  • Hot-swap board insertion and bus isolation

Product Options

Part Number Part Status Pkg. Type Carrier Type MOQ Buy Sample
Active SOICN Tube 980
Availability
Active SOICN Reel 2500
Availability
Active TDFN Tube 100
Availability
Active TDFN Reel 6000
Availability
Active TDFN Tube 100
Availability
Active TDFN Reel 6000
Availability
Active MSOP Tube 50
Availability
Active MSOP Reel 2500
Availability

Documentation & Downloads

Title Other Languages Type Format File Size Date
Datasheets & Errata
ISL33001, ISL33002, ISL33003 Datasheet Datasheet PDF 1.01 MB
User Guides & Manuals
ISL33001MSOPEVAL1Z, ISL33002MSOPEVAL1Z, ISL33003MSOPEVAL1Z User Guide Manual PDF 418 KB
Application Notes & White Papers
AN1637: Level Shifting Down to 1.8V Using 3.3V I2C Buffers Application Note PDF 303 KB
PCNs & PDNs
PCN13025 - Alternate Bond Wire Material and Manufacturing Facilities for Assembly of the Listed Intersil DFN/QFN Packaged Products - Advanced Semiconductor Engineering (ASECL) - Chung-Li , Taiwan and STATS ChipPAC (SCM) - Kuala Lumpur, Mal Product Change Notice PDF 106 KB
PCN13009 - Alternate Bond Wire Material and Manufacturing Facilities for Assembly of the Listed Intersil DFN/QFN Packaged Products - Advanced Semiconductor Engineering (ASECL) - Chung-Li (ASECL), Taiwan and STATS ChipPAC (SCM) - Kuala Lump Product Change Notice PDF 173 KB
PCN13005 - Alternate Bond Wire Material for Assembly of the Listed Intersil DFN/QFN Packaged Products - Carsem (CAS) Ipoh, Malaysia Product Change Notice PDF 84 KB
PCN12085 - 8l, 14l, 16l SOIC w/ Gold Bond Wire @ ATP as Alternate Assembly Site Product Change Notice PDF 152 KB
PCN11059 - Shipping Tube Change for Intersil MSOP Packaged Products Product Change Notice PDF 117 KB
Downloads
ISL3300XMSOPEVAL1Z Design Files Design File ZIP 1.91 MB
Other
PA14042 - Minimum Line Quantity Change Product Advisory PDF 363 KB

Boards & Kits

Part Number Title Type Company
ISL33001MSOPEVAL1Z I2C Bus Buffer with Rise Time Accelerators and Hot Swap Capability Evaluation Board Evaluation Renesas
ISL33002MSOPEVAL1Z I2C Bus Buffer with Rise Time Accelerators and Hot Swap Capability Evaluation Board Evaluation Renesas
ISL33003MSOPEVAL1Z I2C Bus Buffer with Rise Time Accelerators and Hot Swap Capability Evaluation Board Evaluation Renesas