Title Information
Package Name W6X6.36D
Package Previous Code WPZ
Package Description 6x6 36 balls, 0.4mm Pitch, WLCSP; ASE Chung-Li
Package Status Active
Package Type WLCSP-BP
Package Code WPZ
Category PLASTIC
Lead Count 36
Pb (Lead) Free Yes
Length 2.41mm
Width 2.41mm
Thickness 0.5mm
Pitch 0.4mm
Pkg. Dimensions (mm) 2.41 x 2.41 x 0.50

Documentation
Type Title Date
Package Outline Drawing
W6x6.36D: 36 Ball Wafer Level Chip Scale Package (WLCSP 0.4mm Pitch)
PDF 152 KB
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