Title Information
Package Name W3X3.9H
Package Previous Code WPL
Package Description 9 Ball 3x3 Array UltraThin Wafer Level Chip Scale Package (WLCSP 0.4mm Pitch)
Package Status Active
Package Type WLCSP-BP
Class PLASTIC
Package Code WPL
Category PLASTIC
Lead Count 9
Pb (Lead) Free Yes
Length 1.45mm
Width 1.45mm
Thickness 0.28mm
Pitch 0.4mm
Pkg. Dimensions (mm) 1.45 x 1.45 x 0.28

Documentation
Type Title Date
Package Outline Drawing
Package Drawing WLCSP-BP 9pin W3X3.9H
PDF 149 KB
1 item