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| Title | Type | Format | File Size | Language | Date | |
|---|---|---|---|---|---|---|
| Package Outline Drawing Package Code: NCG8P1 8-DFN 2.0 x 3.0 x 0.75 mm Body, 0.5mm Pitch | Package Outline Drawing | 193 KB | English | |||
| PDN# : M-18-02 Product Discontinuance Notice for Select Devices | End Of Life Notice | 18 KB | English | |||
| PCN# : M1806-01 Moving from TSMC to SMIC on Select Devices | Product Change Notice | 528 KB | English | |||
| TSE2004GB2B0 Datasheet | Datasheet | 1.32 MB | English | |||
| Green Products RoHS Material Declaration Certificate | Certificate | 170 KB | English | |||
| IDT DDR4 LRDIMMs Let You Have It All | White Paper | 1.08 MB | English | |||
| DDR4 LRDIMMs For Both Memory Capacity and Speed | White Paper | 5.22 MB | English |