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Search has returned 36 results
Title Type Format File Size Language Date
PLC# : 230010 End-of-Life (EOL) process on select part numbers End Of Life Notice PDF 1.11 MB English
PLC# : 230001 End-of- Life (EOL) process on select part numbers End Of Life Notice PDF 1.29 MB English
PCN# : A1905-01 Alternate Assembly Location & Change of Material Sets Product Change Notice PDF 313 KB English
DCG16 Package Outline Drawing 0.150" Body Width 0.050" Pitch SOIC Package Outline Drawing PDF 167 KB English
Package Outline Drawing Package Code: DCG16D1 16-SOIC 9.80 x 3.81 x 1.72 mm Body, 1.27mm Pitch Package Outline Drawing PDF 205 KB English
Green Products RoHS Material Declaration Certificate Certificate PDF 170 KB English
FCT Bus Switch Cross Reference Guide Guide PDF 568 KB English
DCG16 PACKAGE OUTLINE 150 mil SOP Package Outline Drawing PDF 34 KB English
PCN# : A1602-01(R1) Add Greatek Taiwan as Alternate Assembly Product Change Notice PDF 611 KB English
PCN# : A1602-01 Add Greatek Taiwan as Alternate Assembly Product Change Notice PDF 611 KB English
PCN# : A1511-01(R1) Add SPEL India as Alternate Assembly Location Product Change Notice PDF 596 KB English
PCN# : A1511-01 Add SPEL India as Alternate Assembly Location Product Change Notice PDF 544 KB English
PCN# : TB1403-01 Changed in Carrier Tape, Plastic Reel and Quantity per Reel on TSSOP-14, TSSOP-16 Product Change Notice PDF 663 KB English
QS3VH257 Datasheet Datasheet PDF 336 KB English
PCN#: A-0410-02, Change IDT marking logo with new IDT gridless w Product Change Notice PDF 24 KB English
Errata LEN-08-01 Device Errata PDF 64 KB English
PCN# : A0807-02 Copper Bond Wire for SSOP, SOIC and TSSOP Product Change Notice PDF 143 KB English
PCN# A-0508-02: OSET Alternate Assembly Location for Green Product Change Notice PDF 18 KB English
PCN#A-0504-02R1: Assembly Transfer IDT-Manila to OSE-Ph Product Change Notice PDF 16 KB English
PCN#: A-0504-02, Transfer assembly facility IDT-Manila to OSE-Ph Product Change Notice PDF 47 KB English
PCN#: TB-0504-01, Transfer Test & Backend from IDT-Manila to IDT Product Change Notice PDF 35 KB English
PCN # A-0406-07Rev.1, Qualify OSE-Taiwan for SSOP & TSSOP Product Change Notice PDF 21 KB English
PCN#:A-0401-01, new m/c G600 & 8290 d/a material Product Change Notice PDF 196 KB English
QS3VH257 IBIS Model Model - IBIS ZIP 9 KB English
PCN#:A-0312-01, new mold compound material - G600 Product Change Notice PDF 109 KB English
PCN#:A-0312-02, new die attach material - 8290 Product Change Notice PDF 116 KB English
PCN Addendum # L0203-10R1 Fab 2 to Fab 4 Transfer Product Change Notice PDF 110 KB English
PCN# L0206-11 ICCQ Max Limit Change Product Change Notice PDF 9 KB English
PCN# G-0203-05 Mold Compound Product Change Notice PDF 40 KB English
PCN# L0203-10 Fab Transfer from Fab 2 to Fab 4 Product Change Notice PDF 27 KB English
PCN# L0108-01R1, Die Revision from YQ, ZQ, QC to Z Product Change Notice PDF 12 KB English
QS3VH257 Hspice Model Model - SPICE ZIP 18 KB English
PCN# G0106-01, Moisture Sensitive Label Change Product Change Notice PDF 274 KB English
PCN# G0005-01, Laser Top Mark Product Change Notice PDF 24 KB English
PCN# G9911-05, To qualify low alpha mold compound. Product Change Notice PDF 44 KB English
AN-20: Board Assembly for 0.4mm Pin Surface Mounts Application Note PDF 61 KB English