Title | Type | Format | File Size | Language | Date | |
---|---|---|---|---|---|---|
Termination Options for High-Speed LVCMOS Driver Clock Drivers | Application Note | 187 KB | English | |||
Package Outline Drawing Package Code: CMG8D1 8-DFN 2.0 x 2.0 x 0.5 mm Body, 0.5mm Pitch | Package Outline Drawing | 370 KB | English | |||
Clock Distribution Overview | Overview | 217 KB | English | |||
PCN# : A1905-02 Adding Carsem, Malaysia as Alternate Assembly Location & Change Material Sets | Product Change Notice | 268 KB | English | |||
PCN# : A1602-01(R1) Add Greatek Taiwan as Alternate Assembly | Product Change Notice | 611 KB | English | |||
PCN# : A1602-01 Add Greatek Taiwan as Alternate Assembly | Product Change Notice | 611 KB | English | |||
651S Datasheet | Datasheet | 305 KB | English | |||
AN-842 Thermal Considerations in Package Design and Selection | Application Note | 495 KB | English | |||
AN-840 Jitter Specifications for Timing Signals | Application Note | 442 KB | English | |||
AN-815 Understanding Jitter Units | Application Note | 565 KB | English |