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Search has returned 15 results
Title Type Format File Size Language Date
Package Outline Drawing Package Code: ATG253D1 253-FCCSP (FCBGA) 8.00 x 13.50 x 1.32 mm Body, 0.50 x 0.65mm Pitch Package Outline Drawing PDF 213 KB English
PCN# : A1911-01 Adding 2D barcode on product marking Product Change Notice PDF 493 KB English
PCN# A1901-01 : Assembly Sample Open/Short Test Introduced at Amkor and Stats Chippac, Korea Product Change Notice PDF 208 KB English
Memory Interface Products Family Overview Overview PDF 515 KB English
PCN# : A1903-01 Add alternate bump location and Transfer Assembly Location Product Change Notice PDF 294 KB English
PCN# : A1902-03 Add ASECL as an alternate assembly facility. Product Change Notice PDF 246 KB English
Green Products RoHS Material Declaration Certificate Certificate PDF 170 KB English
PCN# : A1706-01 (R2) Change in Bumping Location on Select Packages Product Change Notice PDF 78 KB English
PCN# : A1706-01 (R1) Change in Bumping Location on Select Packages Product Change Notice PDF 77 KB English
PCN# : A1706-01 Change in Bumping Location on Select Packages Product Change Notice PDF 32 KB English
IDT DDR4 LRDIMMs Let You Have It All White Paper PDF 1.08 MB English
AT/ATG253 8.00 x 13.50 mm BODY DUAL PITCH (0.50 mm x 0.65 mm) FCCSP Package Outline Drawing PDF 272 KB English
PCN# : A1409-02 Alternate Bump and Assembly Location FCCSP-253 Product Change Notice PDF 25 KB English
PCN# : TB1407-02 Alternate Test and Backend Location Product Change Notice PDF 22 KB English
DDR4 LRDIMMs For Both Memory Capacity and Speed White Paper PDF 5.22 MB English