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Renesas offers a variety of easy-to-use boards for evaluation of MCU and MPU products targeted at kick starting your development project.
Product ID | Title | Type | Company |
---|---|---|---|
HJ-531IMF | DA14531 Hongjia HJ-531IMF Ultra-Small, Ultra-Low Power Bluetooth 5.1 SIP Module | Development | Tangshan HongJia Electronic Technology Co., Ltd |
HJ-DA16200 | DA16200 Hongjia HJ-DA16200 Wi-Fi SIP Module | Development | Tangshan HongJia Electronic Technology Co., Ltd |
SESUB-PAN-DA14580 | TDK Bluetooth® Low Energy Module | Development | TDK Corporation |
SESUB-PAN-DA14580 | TDK Bluetooth® Low Energy Module | Development | TDK Corporation |