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ルネサスマイコン評価のためのユーザフレンドリーな開発環境をご提供します。
製品番号 | タイトル | 分類 | 会社名 |
---|---|---|---|
RTK7AECLD2S00001BU | AE-CLOUD2 - グローバル LTE IoT セルラー Connectivity Example | Development | Renesas |
TSI350A-RDK1 | System Development Kit for the TSI350A | Development | Renesas |
DA14695MOD-00DEVKT-P | SmartBond™ DA14695 Module Bluetooth Low Energy 5.2 Development Kit Pro | Development | Renesas |
SLG46117V-DIP | GreenPAK SLG46117 20-pin DIP Prototyping Board | Development | Renesas |
RazorMotion | 自動運転機能の効率的なインテグレーションのための、ソフトウェアおよび開発支援環境を備えた試作ECU用HADプラットフォーム | Development | Renesas |
DA14683-00A9DEVKT-P | SmartBond™ DA14683 Bluetooth Low Energy 5.0 Development Kit Pro | Development | Renesas |
SLG46585M-SKT | GreenPAK SLG46585 Development Kit with Socket Adapter | Development | Renesas |
YSAECLOUD2 | AE-CLOUD2 – Google Cloud Platform IoT Connectivity Example | Development | Renesas |
SLG46117V-SKT | GreenPAK SLG46117 Development Kit with Socket Adapter | Development | Renesas |
SLG47004V-DIP | GreenPAK SLG47004 20-pin DIP Prototyping Board | Development | Renesas |
FTCLICK | MikroBUS™ Compatible Interface Module | Development | MikroElektronika |
89KTPES8T5A | System Development Kit for the 89HES8T5A | Development | Renesas |
DA14683-00A9DEVKT-U | SmartBond™ DA14683 Bluetooth Low Energy Basic Development Kit | Development | Renesas |
SLG46620AG-SKT | GreenPAK SLG46620-A Development Kit with Socket Adapter | Development | Renesas |
RTK7DKS124S00002BU | DK-S124開発キット | Development | Renesas |
SLG46120V-DIP | GreenPAK SLG46120 20-pin DIP Prototyping Board | Development | Renesas |
SLG47004V-SKT | GreenPAK SLG47004 Development Kit with Socket Adapter | Development | Renesas |
89KTPES8NT2 | System Development Kit for the 89HPES8NT2 | Development | Renesas |
DA14683-00U2DB-P | SmartBond™ DA14683 Bluetooth Low Energy 5.1 Development Kit Pro - WL-CSP53 Daughterboard | Development | Renesas |
SLG46620G-SKT | GreenPAK SLG46620 (TSSOP-20) Development Kit with Socket Adapter | Development | Renesas |
DK-S128 | DK-S128開発キット | Development | Renesas |
DA14695MOD-00F1DB-P | SmartBond™ DA14695 Bluetooth® Low Energy 5.2 Module Development Kit Pro - Daughterboard | Development | Renesas |
SLG46120V-SKT | GreenPAK SLG46120 Development Kit with Socket Adapter | Development | Renesas |
BDE-BLEM301 | Bluetooth® 5.1 Low Energy Module | Development | BDE Technology Inc. |
89KTPES8T5 | System Development Kit for the PES8T5 PCI Express I/O Expansion Switch | Development | Renesas |
DA14695-00HQDB-P | SmartBond™ DA14695 Bluetooth® Low Energy 5.2 Development Kit Pro - VFBGA86 Daughterboard | Development | Renesas |
SLG46620V-DIP | GreenPAK SLG46620 (STQFN-20) 20-pin DIP Prototyping Board | Development | Renesas |
SLG4DVKGSD | GreenPAK Serial Debugger Board (GSD) | Development | Renesas |
DK-S7G2 | DK-S7G2開発キット | Development | Renesas |
RTK0EMA5K0S00020BJ | MCK-RA8T1 Renesas Flexible Motor Control Kit for RA8T1 MCU Group | Development | Renesas |
SLG46121V-DIP | GreenPAK SLG46121 20-pin DIP Prototyping Board | Development | Renesas |
SLG47105V-DIP | HVPAK SLG47105 20-pin DIP Prototyping Board | Development | Renesas |
PAN1740A | Panasonic Bluetooth® 5.0 with Small Size (DA14585) | Development | Panasonic Corporation of North America |
SPARKFUN-THING-PLUS-DA16200 | SparkFun Thing Plus - DA16200 Features a Highly Integrated Low Power Wi-Fi SoC for Developing Wi-Fi and IoT Solutions | Development | SparkFun Electronics |
89KTPES6T5 | System Development Kit for the 89HPES6T5 | Development | Renesas |
DA14695-00HQDEVKT-P | SmartBond™ DA14695 Bluetooth Low Energy 5.2 Development Kit Pro | Development | Renesas |
SLG46620V-SKT | GreenPAK SLG46620 (STQFN-20) Development Kit with Socket Adapter | Development | Renesas |
RTK7PEHMP1S00002BU | ヒューマンマシンインタフェース(HMI) PE-HMI1 | Development | Renesas |
EVKVC6-69xxPROG | Programmer Board for VersaClock® 6 - 5P49V69xx | Development | Renesas |
RTK0EMA5K0C00000BJ | MCB-RA8T1 CPU Board for RA8T1 MCU Group | Development | Renesas |
SLG46121V-SKT | GreenPAK SLG46121 Development Kit with Socket Adapter | Development | Renesas |
HJ-DA16200 | DA16200 Hongjia HJ-DA16200 Wi-Fi SIP Module | Development | Tangshan HongJia Electronic Technology Co., Ltd |
89KTPES64H16G2 | System Development Kit for the 89H64H16G2 | Development | Renesas |
DA14695-00HQDEVKT-RANG | SmartBond™ Wireless Ranging (WiRa™) Software Development Kit | Development | Renesas |
SLG46621V-DIP | GreenPAK SLG46621 20-pin DIP Prototyping Board | Development | Renesas |
HJ-131IMH | DA14531 Hongjia HJ-131IMH Ultra-Small, Ultra-Low Power Bluetooth 5.1 SIP Module | Development | Tangshan HongJia Electronic Technology Co., Ltd |
AVSHORIZONE | Avnet Silica HoriZone RA Powered by Renesas | Development | Avnet |
RTK7PKS5D9S00001BU | PK-S5D9プロモーションキット | Development | Renesas |
SLG46127M-SKT | GreenPAK SLG46127 Development Kit with Socket Adapter | Development | Renesas |
SLG47105V-SKT | HVPAK SLG47105 Development Kit with Socket Adapter | Development | Renesas |