What's New in Renesas 365

The April update of Renesas 365 marks a major step forward in model-based development, introducing powerful new capabilities centered around two core themes: Solutionizing and Co-Development.

At the heart of this update is a fundamental shift away from fragmented, document-centric workflows toward a truly connected digital engineering experience spanning system, hardware, and software domains.

Introducing the System Data Model (SDM)

Under the hood, this update introduces a major new cross-domain modeling mechanism called the System Data Model (SDM). SDM digitally connects the domains of:

• System design
• Hardware design
• Software development

This creates a shared model foundation that allows these traditionally disconnected domains to remain synchronized, while also enabling differences and conflicts to be identified and resolved.

SDM is now the underpinning technology behind several major Renesas 365 capabilities, including:

• Board Support Package (BSP) generation from system intent
• Solutionizing
• Cross-domain co-design
• Cross-probing and contextual navigation

This is real model-based collaboration in action - replacing fragile document handoffs with connected digital intent.

From System Intent to BSP - Automatically

One of the most exciting capabilities in this update is the ability to scaffold a Board Support Package (BSP) directly from high-level system intent.

Using block-diagram-based design in Electronic System Designer (ESD), developers can now define systems at a functional level using simple interface definitions. From there, the Renesas 365 platform leverages its model-based constraint engine to automatically determine a valid device configuration and generate the associated BSP scaffolding.

This dramatically reduces the upfront effort required to move from concept to implementation, while also helping ensure configurations are valid from the start.

Constraint Modeling Now Understands Evaluation Boards

The platform now goes a step further by incorporating evaluation board awareness directly into the modeling process.

By providing evaluation board context, the constraint modeler understands which pins and resources are already reserved or unavailable on a specific kit, automatically avoiding conflicts during BSP generation.

This is a critical capability because it enables developers to scaffold BSPs that are not only valid for the target MCU, but also practical for the physical evaluation hardware they are using.

The result is a much smoother path to prototyping and expansion, making it easier to confidently connect external devices through expansion headers and available interfaces - knowing the generated configuration is designed to work within the constraints of the board.

Solutionizing: From Embedded Project to Full Renesas 365 Solution

The new Solutionizing capability enables existing RA MCU software projects to be transformed into fully connected Renesas 365 solutions in an automated manner.

Rather than treating software as an isolated artifact, projects can now become part of a broader system-aware solution that connects software, hardware, configuration, and lifecycle data together.

This creates a much more scalable and maintainable development experience, while also laying the foundation for richer automation and collaboration workflows across teams.

Co-Design Across Hardware and Software

The April update also introduces significant advances in co-design workflows between hardware and software domains.

Pin assignments and configuration data can now flow bidirectionally between domains, enabling hardware development in Altium Designer and software development in e² studio to stay synchronized automatically.

This means engineers no longer need to manually reconcile pin configurations across disconnected tools and spreadsheets. Changes can propagate across domains, helping teams maintain alignment while dramatically reducing integration friction and configuration errors.

Cross-Probing: From Source Code to Board

Another standout capability in this update is cross-probing between source code and hardware design context. Developers can now navigate directly from software to board-level context, including highlighted pins and nets.

This makes common development tasks significantly easier, such as:

• Finding where to place a scope probe
• Identifying which header pins to wire to an external device
• Understanding hardware connectivity directly from software context

Instead of chasing information across PDFs, schematics, notes, and pin tables, Renesas 365 now provides a connected and interactive experience that bridges the gap between code and physical hardware.

It's not only more efficient - it's simply a more intuitive and enjoyable way to develop embedded systems.

Enhanced System-Level Exploration with RA Explorer

To round out this update, RA Explorer now includes a powerful new before-and-after comparison view.

This enables developers to visually understand the impact of device changes at the system level, making exploration and tradeoff analysis significantly easier.

Whether evaluating alternative devices, understanding resource impacts, or comparing configurations, the enhanced explorer experience provides much deeper visibility into system-level consequences and opportunities.

Moving Beyond Document-Centric Engineering

Taken together, the capabilities in this update represent an important evolution toward connected, model-based engineering workflows.

By digitally linking system intent, hardware design, and software implementation, Renesas 365 is helping enable a more collaborative, scalable, and intelligent development experience - reducing friction, minimizing errors, and accelerating the path from concept to working system.

This is the future of co-development and solution creation - and it's arriving now in Renesas 365.