图像
对于刚接触该技术的用户来说,为系统添加 Bluetooth® Low Energy (LE) 功能可能具有一定挑战性。 要创建具有必备无线性能并获得相关审批的最终产品,从组件选择到射频布局和监管认证都任务量巨大。
使用经过认证的模块对这项工作大有帮助。 瑞萨电子的所有蓝牙 LE 模块均通过合规性认证、蓝牙认证和外部电路认证,因此客户无需自行将其集成到产品中。 参数搜索表中内置天线和外置天线列中标注为 “可用” (available) 的产品为模块化产品。 此外,瑞萨电子还为最终产品提供蓝牙认证指南。
应用 |
Wireless Standard |
Proprietary 2G4 protocol |
CPU |
Flash Memory (KB) |
ROM (KB) |
Memory Size (OTP) (KB) |
RAM (KB) |
GPIOs (#) |
Supply Voltage Vcc Range |
Integrated DCDC |
Integrated Battery Charger |
External Rails and Load Capacity |
Tx Current (mA) |
Rx current (mA) |
Output Power Range (dBm) |
Sensitivity (dBm) (dBm) |
Clock Rate (MHz) |
Flexible System Clock |
Execute from FLASH |
Hardware Crypto Engine |
QSPI Interface (#) |
SPI (#) |
I2C (#) |
UART (#) |
ADC |
USB Ports (#) |
LE Data Length Extensions |
2Mbps |
LE Coded PHY (Long Range) |
Advertising Extensions |
Periodic Advertising |
AoA |
AoD |
GATT Caching |
Bluetooth® Mesh |
Pkg. Type |
Price (USD) | 1ku |
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器件号 | ||||||||||||||||||||||||||||||||||||||
超高集成度的蓝牙™ 5.2单芯片解决方案 | Consoles, E-bike, HMI, Rechargeable devices, Smart Home, Wearables | BLE 5.2 Core specification + optional features | Yes | M33F | 0 | 32 | 4 | 1536 | 79 | 2.9-4.75 | Yes, Low-IQ SIMO Buck & 4.5-5V Boost | Yes, 720mA JEITA compliant charger | 2 x 1.8V @ 100mA each | 3 | 1.85 | 6 | -97 | 160 | 是 | 是 | 是 | 3 | 3 | 4 | 3 | 11 ENOB, 16Ksps with PGA | 1 | Supported | Supported | Not Supported | CABGA | |||||||
超高集成度的蓝牙™ 5.2单芯片解决方案 | Consoles, E-bike, HMI, Rechargeable devices, Smart Home, Wearables | BLE 5.2 Core specification + optional features | Yes | M33F | 0 | 32 | 4 | 1536 | 79 | 2.9-4.75 | Yes, Low-IQ SIMO Buck & 4.5-5V Boost | Yes, 720mA JEITA compliant charger | 2 x 1.8V @ 100mA each | 3 | 1.85 | 6 | -97 | 160 | 是 | 是 | 是 | 3 | 3 | 4 | 3 | 11 ENOB, 16Ksps with PGA | 1 | Supported | Supported | Not Supported | CABGA | 6.654 | ||||||
超高集成度的蓝牙™ 5.2单芯片解决方案 | Consoles, E-bike, HMI, Rechargeable devices, Smart Home, Wearables | BLE 5.2 Core specification + optional features | Yes | M33F | 0 | 32 | 4 | 1536 | 79 | 2.9-4.75 | Yes, Low-IQ SIMO Buck & 4.5-5V Boost | Yes, 720mA JEITA compliant charger | 2 x 1.8V @ 100mA each | 3 | 1.85 | 6 | -97 | 160 | 是 | 是 | 是 | 3 | 3 | 4 | 3 | 11 ENOB, 16Ksps with PGA | 1 | Supported | Supported | Not Supported | CABGA | 6.792 | ||||||
超高集成度的蓝牙™ 5.2单芯片解决方案 | Consoles, E-bike, HMI, Rechargeable devices, Smart Home, Wearables | BLE 5.2 Core specification + optional features | Yes | M33F | 0 | 32 | 4 | 1536 | 79 | 2.9-4.75 | Yes, Low-IQ SIMO Buck & 4.5-5V Boost | Yes, 720mA JEITA compliant charger | 2 x 1.8V @ 100mA each | 3 | 1.85 | 6 | -97 | 160 | 是 | 是 | 是 | 3 | 3 | 4 | 3 | 11 ENOB, 16Ksps with PGA | 1 | Supported | Supported | Not Supported | CABGA | 6.824 | ||||||
SmartBond™ Low Power Bluetooth 5.1 System-on-Chip | Low cost BLE connectivity front-end and data pipe | BLE 5.1 Core specification | No | M0+ | 0 | 144 | 32 | 48 | 12 | 1.8-3.3 | N/A | No | 3.5 | 2.2 | 2.5 | -94 | 16 | 是 | 否 | 是 | 1 | 1 | 2 | 10-bit x 4-ch | 0 | Supported | FCGQFN | 0.7469 | ||||||||||
SmartBond™ 超低功耗蓝牙® 5.1 片上系统 | Asset tracking, Beacons, Connected health, Disposables, RCU | BLE 5.1 Core specification | No | M0+ | 0 | 144 | 32 | 48 | 12 | 1.1-3.6 | Integrated Buck/Boost DC-DC converter | No | 3.5 | 2.2 | 2.5 | -94 | 16 | 是 | 否 | 是 | 1 | 1 | 2 | 10-bit x 4-ch | 0 | Supported | FCGQFN, WLCSP | 0.8494 | ||||||||||
SmartBond TINY™ 蓝牙®低功耗模块 | Asset tracking, Beacons, Connected health, Disposables, RCU | BLE 5.1 Core specification | No | M0+ | 0 | 144 | 32 | 48 | 12 | 1.1-3.6 | Integrated Buck DC-DC converter | No | 3.5 | 2.2 | 2.2 | -94 | 16 | 是 | 否 | 是 | 1 | 1 | 2 | 10-bit x 4-ch | 0 | Supported | MODULE | 2.828 | ||||||||||
SmartBond TINY™ DA14535 Bluetooth® Low Energy 5.3 SoC | Asset tracking, Beacons, Connected health, Disposables, Industrial, RCU | BLE 5.3 Core specification | No | M0+ | 0 | 160 | 12 | 64 | 12 | 1.2-3.6 | Integrated Buck/Boost DC-DC converter | No | 3.1 | 2.5 | 4 | -94.5 | 16 | 是 | 否 | 是 | 1 | 1 | 2 | 10-bit x 4-ch | 0 | Supported | FCGQFN | 0.9226 | ||||||||||
带音频接口的 SmartBond™ 蓝牙 5.0 SoC | Beacons, Human Interface Devices, Proximity Tags, RCU | BLE 5.0 Core specification | No | M0 | 0 | 128 | 64 | 96 | 14, 25 | 0.9-3.5 | Integrated Buck/Boost DC-DC converter | No | 4.8, 4.9 | 5.1, 5.3 | -93 | 16 | 否 | 否 | 是 | 1 | 1 | 2 | 10-bit x 4-ch | 0 | Supported | QFN40, WLCSP34 | 1.711 | |||||||||||
SmartBond™ Bluetooth 5.0 SoC with Audio Interface and 2Mbit Flash | Beacons, Human Interface Devices, Proximity Tags, RCU | BLE 5.0 Core specification | No | M0 | 256 | 128 | 64 | 96 | 24 | 1.8-3.5 | Integrated Buck DC-DC converter | No | 4.9 | 5.3 | -93 | 16 | 否 | 否 | 是 | 1 | 1 | 2 | 10-bit x 4-ch | 0 | Supported | QFN40 | 2.927 | |||||||||||
SmartBond™ 多核低功耗蓝牙® 5.2 SoC,带嵌入式闪存 | Asset tracking, Connected health and more... |
BLE 5.2 Core specification | Yes | M33 & M0+ | 256 | 288 | 2 | 96 | 32 | 1.8-3.6 | Integrated Buck DC-DC converter | No | 2.1 | 1.2 | 6 | -97 | 64 | 是 | 是 | 是 | 1 | 1 | 1 | 2 | 10-bit x 8-ch, 15-bit x 8-ch | 0 | Supported | Supported | Not Supported | Supported | Not Supported | TX Supported | TX Supported | Not Supported | Not Supported | |||
SmartBond™ Bluetooth® Low Energy 5.0 SoC with Enhanced Security and Flash | Charging cases, Rechargeable devices, USB-to-BLE dongles | BLE 5.0 Core specification | No | M0 | 1024 | 128 | 64 | 128 | 31 | 1.7-4.75 | SIMO Buck DC-DC converter | Yes, 400mA USB charger | 1.8V @ 75mA | 5.2 | 6 | -94 | 96 | 是 | 是 | 是 | 2 | 2 | 2 | 10-bit x 8-ch | 1 | Supported | On request | AQFN60 | 6.93 | |||||||||
SmartBond™ Bluetooth® Low Energy 5.0 SoC with Enhanced Security | Banking, Industrial, Rechargeable devices, USB-to-BLE dongles | BLE 5.0 Core specification | No | M0 | 0 | 128 | 64 | 128 | 37 | 1.7-4.75 | SIMO Buck DC-DC converter | Yes, 400mA USB charger | 1.8V @ 75mA | 5.2 | 6 | -94 | 96 | 是 | 是 | 是 | 1 | 2 | 2 | 2 | 10-bit x 8-ch | 1 | Supported | On request | AQFN60, WLCSP53 | 2.787 | ||||||||
Multi-Core Bluetooth® 5.2 SoC with System Power Management Unit | General purpose connectivity MCU | BLE 5.2 Core specification + optional features | Yes | M33F | 0 | 128 | 4 | 384 | 44 | 2.4-4.75 | SIMO Buck DC-DC converter | No | 3x 1.8V @ 50mA each | 3 | 1.8 | -97 | 96 | 是 | 是 | 是 | 1 | 2 | 2 | 3 | 10-bit x 8-ch, 14-bit x 8-ch | 1 | Supported | Supported | Supported | Supported | Supported | TX Supported | 4.009 | |||||
带系统电源管理单元的多核蓝牙® 5.2 SoC | HMI, Rechargeable devices | BLE 5.2 Core specification + optional features | Yes | M33F | 0 | 128 | 4 | 512 | 44 | 2.4-4.75 | SIMO Buck DC-DC converter | Yes, 560mA JEITA compliant charger | 3x 1.8V @ 50mA each | 3 | 1.8 | 6 | -97 | 96 | 是 | 是 | 是 | 1 | 2 | 2 | 3 | 10-bit x 8-ch, 14-bit x 8-ch | 1 | Supported | Supported | Supported | Supported | Supported | TX Supported | VFBGA86 | 4.131 | |||
SmartBond 低功耗蓝牙™ 5.2 高集成度(包括 USB 充电器)模块 | HMI, Rechargeable devices | BLE 5.2 Core specification + optional features | Yes | M33F | 32000 | 128 | 4 | 512 | 40 | 2.4-4.75 | SIMO Buck DC-DC converter | Yes, 560mA JEITA compliant charger | 1x 3V @ 150mA, 3x 1.8V @ 50mA each | 3 | 1.8 | 6 | -96 | 96 | 否 | 是 | 是 | 1 | 2 | 2 | 3 | 10-bit x 4-ch, 14-bit x 4-ch | 1 | Supported | Supported | Not Supported | Supported | Supported | Supported | TX Supported | Not Supported | Not Supported | MODULE | 9.134 |
Multi-Core Bluetooth® 5.2 SoC with System Power Management Unit | HMI, Rechargeable devices, Wearables | BLE 5.2 Core specification + optional features | Yes | M33F | 0 | 128 | 4 | 512 | 55 | 2.4-4.75 | SIMO Buck DC-DC converter | Yes, 560mA JEITA compliant charger | 3x 1.8V @ 50mA each | 3 | 1.8 | 6 | -97 | 96 | 是 | 是 | 是 | 2 | 2 | 2 | 3 | 10-bit x 8-ch, 14-bit x 8-ch | 1 | Supported | Supported | Supported | Supported | Supported | TX Supported | VFBGA | 4.745 | |||
Multi-Core Bluetooth® 5.2 SoC with System Power Management Unit | 'Analog' Smart Watches, HMI, Rechargeable devices, Wearables | BLE 5.2 Core specification + optional features | Yes | M33F | 0 | 128 | 4 | 512 | 55 | 2.4-4.75 | SIMO Buck DC-DC converter | Yes, 560mA JEITA compliant charger | 3x 1.8V @ 50mA each | 3 | 1.8 | 6 | -97 | 96 | 是 | 是 | 是 | 2 | 2 | 2 | 3 | 10-bit x 8-ch, 14-bit x 8-ch | 1 | Supported | Supported | Supported | Supported | Supported | TX Supported | VFBGA | ||||
带有 48 MHz Bluetooth® 5.0 的低功耗单芯片 32 位微控制器 | BLE 5.0 Core specification + optional features | Arm Cortex-M4 | 512 | 96 | 35 | 1.8-3.6 | 4.5 | 3.3 | 4 | -95 | 48 | 否 | 否 | 是 | 0 | 2 | 2 | 6 | 14-bit x 8-ch | 1 | Supported | Supported | Supported | Not Supported | Not Supported | Not Supported | Supported | QFN | 6.231 | |||||||||
Bluetooth® Low Energy Microcontrollers for Smart Connectivity | BLE 5.0 Core specification | RL78 | 128, 192, 256 | 12, 16, 20 | 32 | 1.6-3.6 | 4.3 | 3.5 | -90 | 32 | 否 | 否 | 否 | 0 | 0 | 3 | 2 | 10-bit x 8-ch | 0 | Not Supported | Not Supported | Not Supported | Not Supported | Not Supported | Not Supported | Not Supported | HWQFN, MLZZ0042ZA-A | 2.531 | ||||||||||
32位单片机和模块产品,可在单个芯片上实现Bluetooth®5无线通信和系统控制,适用于IoT终端设备 | BLE 5.0 Core specification + optional features | RXv2 | 512, 384 | 64 | 44, 30 | 1.8-3.6 | 4.3 | 3 | 4 | -95 | 54 | 否 | 否 | 否, 是 | 0 | 4, 5 | 4, 5 | 3, 4 | 12-bit x 8-ch, 12-bit x 14-ch | 1 | Supported | Supported | Supported | Not Supported | Not Supported | Not Supported | Supported | HVQFN, TFBGA, TFLGA | 6.197 |
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类型 | 文档标题 | 日期 |
白皮书 | PDF 484 KB | |
白皮书 | PDF 716 KB | |
应用文档 | PDF 1.10 MB 日文 | |
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Princess CEO John Padgett talks about transforming the cruise industry with the Renesas DA14695 multi-core Bluetooth® SoC with WiRa in their onboard medallion system to monitor 4,000 Wi-Fi access points, 2,000 crew devices and 8,000 sensors in real time.
瑞萨推出其首款集成闪存的双核低功耗蓝牙SoC并实现最低功耗 | 新闻 | 2024年1月18日 | |
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Executive Blog - Wireless Connectivity Is an Integral Part of Renesas’ Solutions | 博客 | 2023年12月20日 |
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什么是Matter 1.0?它将如何颠覆智能家居? | 博客 | 2023年1月6日 |
瑞萨电子推出首款支持新Matter协议的Wi-Fi开发套件 | 新闻 | 2023年1月5日 | |
瑞萨电子推出高集成度先进低功耗蓝牙无线片上系统 | 新闻 | 2022年6月21日 | |
瑞萨电子宣布开发支持低功耗蓝牙® 5.3的下一代无线MCU | 新闻 | 2021年10月21日 | |
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What’s New in Bluetooth® 5.3 Low Energy | 博客 | 2021年10月19日 |
Renesas Introduces Bluetooth Low Energy Module for Ultra-Low Power IoT Applications | 新闻 | 2020年8月4日 | |
瑞萨电子推出支持蓝牙5的32位MCU,扩充了基于Arm Cortex-M内核的RA产品家族 | 新闻 | 2020年5月7日 |