SmartBond™ DA14695模块低功耗蓝牙5.2开发套件专业版
用于评估DA14695 SmartBond™模组的DA14695MOD-00DEVKT-P低功耗蓝牙开发套件专业版包括一块主板，一块子板以及所需连接线。 该套件主要用于软件应用程序开发和功耗测量。
DA14695 是一个低功耗蓝牙系列，可在极低的功耗水平下运行，同时提供世界顶尖的射频性能。...
SmartBond 低功耗蓝牙™ 5.2 高集成度（包括 USB 充电器）模块
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概览
简介
DA14695 模块以 SmartBond DA14695 低功耗 (LE) 蓝牙™ 5.2 片上系统 (SoC)为基础构建，提供 DA14695 所有硬件特性和功能。 该模块集成了所有无源器件、天线和 一个 32Mbit QSPI 闪存，配有简单易用的软件。 DA14695 模块可满足广泛的市场用途，可以通过各地区认证，大幅降低开发成本与风险，缩短上市时间。
特性
- 多核：以 96MHz CM33F 作为应用内核，96MHz 的 CM0+ 为可配置 MAC，传感器节点控制器
- 集成 (USB) 充电器（支持 JEITA，软件电量计）
- 集成 LCD 显示屏控制器
- 接收灵敏度 -96dBm，发射功率 +6dBm
- 8 通道 14 位 Sigma-Delta ADC
- 512KB RAM
- 7 个电源域可精细提高功耗效率（自动选择开发套件，易于使用）
- “银行级”安全性
- 低功耗蓝牙 5.2 和专有 2.4 GHz 协议
- 丰富的接口选项
产品对比
应用
应用
- 无线医疗设备
- 设备跟踪（可充电）
- 可穿戴设备/健身手环
- HID（游戏/增强现实/虚拟现实）
- 定位（可充电）
- 灵活测距/距离传感 (WiRa™)
- 家庭自动化
- 工业自动化
- 可充电无线产品
设计和开发
软件与工具
软件与工具
| Software title
|
Software type
|
公司
|
|---|---|---|
| SmartBond™ emWin support for DA1469x The emWin embedded graphics library developed by SEGGER Microcontroller is now offered with the SmartBond® DA1469x wireless microcontrollers.
|
Imaging | 瑞萨电子 |
| SmartBond™ Development Tools SmartSnippets™ Studio is a royalty-free software development platform for SmartBond™ devices.
|
Software Package | 瑞萨电子 |
| SmartBond™ Flash Programmer The Renesas SmartBond™ Flash Programmer tool lets the user program a flash device for the DA1453x, DA14585/586, and DA1469x SoCs (System on Chip).
|
Software Package | 瑞萨电子 |
| Renesas Bluetooth® Low Energy Mobile Application Suite Renesas’ comprehensive collection of Bluetooth® Low Energy mobile applications: SmartBond, SmartConfig, SmartConsole, SmartTags, and SUOTA
|
Software Package | 瑞萨电子 |
4 items
|
||
开发板与套件
开发板与套件
SmartBond ™ DA14695 低功耗蓝牙5.2 模块开发套件 Pro - 子板
DA14695MOD-00F1DB-P 是与 DA14695-00HQDEVKT-P 或 DA14695MOD-00DEVKT-P 一起使用的子板。 子板可以轻松连接到任一上述专业开发套件的主板上。 子板包含一个功能丰富的，蓝牙5.2设备DA14695MOD，同时带有集成的USB充电器，有非常广泛的应用场景。
SmartBond™ DA14695 Bluetooth® Low Energy 5.2 Development Kit Pro - VFBGA86 Daughterboard
The DA14695 Development Kit Pro is ideal for software developers who want total control over their software development and want to keep an eye on the power consumption...
SmartBond™ DA14695 Bluetooth Low Energy 5.2 Development Kit Pro
The DA14695 Development Kit Pro is ideal for software developers who want total control over their software development and want to keep an eye on the power consumption...
SmartBond™ Wireless Ranging (WiRa™) Software Development Kit
Renesas' Wireless Ranging (WiRa™) Software Development Kit (SDK) enhances the DA1469x family of Bluetooth® Low Energy (LE) SoCs with highly accurate and reliable...
SmartBond™ DA14695 Bluetooth® Low Energy 5.2 USB Development Kit
This USB development kit gives users the flexibility to develop applications in a small and portable form factor. The USB board has an on-board debugger, which in...
SmartBond™ DA14699 Bluetooth® Low Energy 5.2 Development Kit Pro - VFBGA100 Daughterboard
The DA14695 Development Kit Pro is ideal for software developers who want total control over their software development and want to keep an eye on the power consumption...
Bluetooth Low Energy SoC 16-site Production Line Tool Kit
Renesas offers a production test and programming unit that enables you to reduce the time to ramp-up at a lower cost. The Production Line Tool (PLT) helps to increase...
模型
ECAD 模块
Schematic symbols, PCB footprints, and 3D CAD models from SamacSys can be found by clicking on products in the Product Options table. If a symbol or model isn't available, it can be requested directly from the website.
Processing table
| MODULE | Tape & Reel | 3 | 9.134 | ||
| MODULE | Tape & Reel | 3 |
Tips for Using This Parametric Table:
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- Document icon next to product name in row: View the featured document for this product
- Chip icon next to the right of the document icon in row: View the block diagram for this product
- Cart icon to the right of the chip icon: Indicates that samples are available for this product
视频和培训
Princess Cruise Lines Uses WiRa Technology From Renesas To Deliver A Customized Passenger Experience
Princess CEO John Padgett talks about transforming the cruise industry with the Renesas DA14695 multi-core Bluetooth® SoC with WiRa in their onboard medallion system to monitor 4,000 Wi-Fi access points, 2,000 crew devices and 8,000 sensors in real time.
Video List
WiRa™ 技术
WiRa（Wireless Ranging，无线测距）技术的细粒度接近 UWB（超宽带）精度，提供基于相位的测距性能，同时可明显降低功耗、延长电池寿命并减少解决方案的成本，提供高级专有算法增强性能。
目前市场上用于测距和定位的蓝牙™ 低能耗解决方案，需要测量接收无线电信号的强度或功率，即接收信号强度指示器 (RSSI) 测量。 但无线电路径中物体会阻挡或反射无线电信号，影响敏感度，导致接收功率的测量值可能存在固有缺陷。
WiRa 使用类似于雷达的专有方法，可大幅提高低功耗蓝牙连接设备之间的测距精度。 通过将低功耗蓝牙数据包与恒定频率交换信号进行交错，DA1469x 片上 2.4 GHz 无线电可生成相位测距所需的信号。 无线电波的高分辨率片上采样可提供高质量 IQ 样本，作为距离确定的输入数据。 数据处理算法可过滤数据中的噪声、干扰和反射，产生最短的无线信号路径长度，将其作为精确的距离输出。