图像
产品编号 | 文档标题 | 类型 | 公司 |
---|---|---|---|
SLG46169V-SKT | GreenPAK SLG46169 Development Kit with Socket Adapter | 开发 | Renesas |
SLG4AB2 | 32-pin to 20-pin Adapter for GreenPAK SLG468x | 开发 | Renesas |
HJ-DA16200 | DA16200 Hongjia HJ-DA16200 Wi-Fi SIP Module | 开发 | Tangshan HongJia Electronic Technology Co., Ltd |
DA16200MOD-DEVKT | DA16200 Ultra-Low Power Wi-Fi Modules Development Kit | 开发 | Renesas |
SLG46721V-SKT | GreenPAK SLG46721 Development Kit with Socket Adapter | 开发 | Renesas |
89KTPES8NT2 | System Development Kit for the 89HPES8NT2 | 开发 | Renesas |
HJ-131IMH | DA14531 Hongjia HJ-131IMH Ultra-Small, Ultra-Low Power Bluetooth 5.1 SIP Module | 开发 | Tangshan HongJia Electronic Technology Co., Ltd |
AVSHORIZONE | Avnet Silica HoriZone RA Powered by Renesas | 开发 | Avnet |
DK-S7G2 | DK-S7G2开发套件 | 开发 | Renesas |
SLG46170V-SKT | GreenPAK SLG46170 Development Kit with Socket Adapter | 开发 | Renesas |
SLG4DVKADV | GreenPAK高级开发板 | 开发 | Renesas |
CK-RA6M5 | Cloud Kit Based on RA6M5 MCU Group | 开发 | Renesas |
DA16200MOD-DEVKT-P | DA16200 超低功耗 Wi-Fi 模块开发套件 Pro | 开发 | Renesas |
SLG46722V-DIP | GreenPAK SLG46722 20-pin DIP Prototyping Board | 开发 | Renesas |
89KTPES8T5 | System Development Kit for the PES8T5 PCI Express I/O Expansion Switch | 开发 | Renesas |
EBV-IOT-SMARTCTHERM | RA6M3 + SmartCTherm Smart IoT Sensor Node Solution for Monitoring Indoor Climate Conditions | 开发 | Avnet |
RTK7PEHMP1S00002BU | PE-HMI1产品示例 | 开发 | Renesas |
SLG46538M-DIP | GreenPAK SLG46538 (MSTQFN-20) 20 引脚 DIP 原型开发板 | 开发 | Renesas |
SLG46517M-DIP | GreenPAK SLG46517 20-pin DIP Prototyping Board | 开发 | Renesas |
SLG4DVKDIP | GreenPAK DIP Development Board | 开发 | Renesas |
CK-RX65N | Cloud Kit Based on RX65N MCU Group | 开发 | Renesas |
DA16600MOD-DEVKT | DA16600 Ultra-Low Power Wi-Fi + Bluetooth Low Energy Modules Development Kit | 开发 | Renesas |
SLG46722V-SKT | GreenPAK SLG46722 Development Kit with Socket Adapter | 开发 | Renesas |
89KTPES6T5 | System Development Kit for the 89HPES6T5 | 开发 | Renesas |
TW001-VUI-RISCVPOCZ | 瑞萨 ASSP EASY 语音 HMI 套件 | 开发 | Renesas |
RTK7PKS5D9S00001BU | PK-S5D9 促销套件 | 开发 | Renesas |
SLG46580V-DIP | GreenPAK SLG46580 (STQFN-20) 20 针 DIP 原型开发板 | 开发 | Renesas |
DA14535-00FXDB-P | SmartBond™ DA14535 Bluetooth® Low Energy 5.3 SoC 开发套件专业版子板 | 开发 | Renesas |
EVKVC6-69xxPROG | Programmer Board for VersaClock® 6 - 5P49V69xx | 开发 | Renesas |
SLG46517M-SKT | GreenPAK SLG46517 Development Kit with Socket Adapter | 开发 | Renesas |
SLG4DVKINTRO | GreenPAK Introduction Kit | 开发 | Renesas |
DA16600MOD-DEVKT-P | DA16600 Ultra-Low Power Wi-Fi + Bluetooth Low Energy Modules Development Kit - Pro | 开发 | Renesas |
SLG46811V-DIP | GreenPAK SLG46811 20-pin DIP Prototyping Board | 开发 | Renesas |
89KTPES64H16G2 | System Development Kit for the 89H64H16G2 | 开发 | Renesas |
SLG46582V-DIP | GreenPAK SLG46582 (STQFN-20) 20 针 DIP 原型开发板 | 开发 | Renesas |
DA14535-00FXDEVKT-P | SmartBond TINY™ DA14535 Bluetooth® Low Energy 5.3 SoC 开发套件专业版 | 开发 | Renesas |
SLG46533M-DIP | GreenPAK SLG46533M 20-pin DIP Prototyping Board | 开发 | Renesas |
SLG46811V-SKT | GreenPAK SLG46811 Development Kit with Socket Adapter | 开发 | Renesas |
89KTPES64H16AG2 | System Development Kit for the 89H64H16AG2 | 开发 | Renesas |
SLG46583V-DIP | GreenPAK SLG46583 (STQFN-20) 20 针 DIP 原型板 | 开发 | Renesas |
SLG46537-DIP | Programmable Mixed-Signal Matrix with Asynchronous State Machine Board | 开发 | Renesas |
SLG46533M-SKT | GreenPAK SLG46533M Development Kit with Socket Adapter | 开发 | Renesas |
DA7400-DEVKT | DA7400 Development Kit | 开发 | Renesas |
SLG46824G-SKT | GreenPAK SLG46824 (TSSOP-20) Development Kit with Socket Adapter | 开发 | Renesas |
89KTPES64H16 | System Development Kit for the PES64H16 PCI Express System Interconnect Switch | 开发 | Renesas |
SLG46533V-DIP | GreenPAK SLG46533V 20-pin DIP Prototyping Board | 开发 | Renesas |
SLG46824V-DIP | GreenPAK SLG46824 20-pin DIP Prototyping Board | 开发 | Renesas |
89KTPES4T4G2 | System Development Kit for the 89HPES4T4G2 | 开发 | Renesas |
HJ-580CY | DA14580 HongJia HJ-580CY Bluetooth® Low Energy 4.2 Module | 开发 | Tangshan HongJia Electronic Technology Co., Ltd |
DA14530-00FXDB-P | SmartBond TINY™ DA14530 Bluetooth® Low Energy Dev Kit Pro - FCGQFN24 Daughterboard | 开发 | Renesas |