The 71V25761 3.3V CMOS Synchronous SRAM is organized as 128K x 36 and contains write, data, address and control registers. The burst mode feature offers the highest level of performance to the system designer, as the 71V25761 can provide four cycles of data for a single address presented to the SRAM.

特性

  • High system speed 200MHz (3.1ns clock access time)
  • LBO input selects interleaved or linear burst mode
  • Self-timed write cycle with global write control (GW), byte write enable (BWE), and byte writes (BWx)
  • 3.3V core power supply
  • Power down controlled by ZZ input
  • 2.5V I/O
  • Optional - Boundary Scan JTAG Interface (IEEE 1149.1 Compliant)
  • Available in 100-pin TQFP and 119-pin BGA packages

产品选择

器件号 Part Status Pkg. Type Lead Count (#) Temp. Grade Pb (Lead) Free Carrier Type Buy Sample
71V25761S166PFG
Active TQFP 100 C 是的 Tray
Availability
71V25761S166PFG8
Active TQFP 100 C 是的 Reel
Availability
71V25761S183PFG
Active TQFP 100 C 是的 Tray
Availability
71V25761S183PFG8
Active TQFP 100 C 是的 Reel
Availability
71V25761S183PFGI
Active TQFP 100 I 是的 Tray
Availability
71V25761S183PFGI8
Active TQFP 100 I 是的 Reel
Availability
71V25761S200PFG
Active TQFP 100 C 是的 Tray
Availability
71V25761S200PFG8
Active TQFP 100 C 是的 Reel
Availability
71V25761S200PFGI
Active TQFP 100 I 是的 Tray
Availability
71V25761S200PFGI8
Active TQFP 100 I 是的 Reel
Availability

文档和下载

文档标题 language 类型 文档格式 文件大小 日期
数据手册与勘误表
71V25761 Datasheet 数据手册 PDF 177 KB
PCN / PDN
PCN# : A1606-02 Add Greatek Taiwan as Alternate Assembly 产品变更通告 PDF 567 KB
PCN#: A1309-03 Additional Assembly Sources 产品变更通告 PDF 398 KB
PCN#: A-0410-02, Change IDT marking logo with new IDT gridless w 产品变更通告 PDF 24 KB
PDN# : SR-08-03R1 PRODUCT DISCONTINUANCE NOTICE ON SELECTIVE SPO PRODUCTS 产品删除通告 PDF 254 KB
PCN# : A0706-04 MSL LEVEL 4 TO MSL LEVEL 3 FOR SELECTIVE TQFP-100 DEVICES 产品变更通告 PDF 101 KB
PCN#: A-0611-02 Transfer of Assembly Build for PBGA 119 (Green & Standard) from ATK, Korea to ATP, Philippines 产品变更通告 PDF 120 KB
PCN# A-0607-05 Green Mold Compound KMC3580 for BGA 产品变更通告 PDF 194 KB
A-0603-04 Transfer TQFP and PQFP from ASAT HK to ASAT China 产品变更通告 PDF 164 KB
PCN#: TB-0512-01 Reel Color Changed from Blue to Black 产品变更通告 PDF 729 KB
PCN # SR-0505-02 FPBGA BQ165 Solder Pad Opening/Ball Diameter 产品变更通告 PDF 163 KB
PCN A-0506-03; Packing Material Change 产品变更通告 PDF 290 KB
PCN#: A-0412-04 - To comply with Pb-free labels - Green Products 产品变更通告 PDF 80 KB
PCN#: A-0403-03, BGA package family 产品变更通告 PDF 38 KB
PCN#: A-0309-05, new m/c-G770 & d/a-2300 material 产品变更通告 PDF 211 KB
PCN#: A-0310-01, Green Products 产品变更通告 PDF 26 KB
PCN#:G-0303-01, new m/c G700 & 3230 d/a material 产品变更通告 PDF 138 KB
PCN# G-0206-08, Orientation of square PQFP & TQFP 产品变更通告 PDF 150 KB
PCN# G-0110-06 REV.1 Mold Compound 产品变更通告 PDF 48 KB
PCN SR0201-01 Die rev,Z(cemos 10) to Y (cemos11.5) 产品变更通告 PDF 22 KB
PCN# G-0110-06 Mold Compound 产品变更通告 PDF 47 KB
PCN# G9911-05, To qualify low alpha mold compound. 产品变更通告 PDF 44 KB
下载
71V25761_BG IBIS Model 模型 - IBIS ZIP 9 KB
71V25761_PF IBIS Model 模型 - IBIS ZIP 9 KB
71V25761 Verilog Model 模型 - Verilog TAR 61 KB