The QS3390 provides a 16:8 multiplexer logic switch. The low ON resistance (5 ohm) of the QS3390 allows inputs to be connected to the outputs without adding propagation delay and without generating additional ground bounce noise. Mux/Demux devices provide an order of magnitude faster speed than equivalent logic devices. The QS3390 operates at -40C to +85C.

特性

  • Enhanced N channel FET with no inherent diode to Vcc
  • 16:8 multiplexer function with zero delay
  • 5 ohm bidirectional switches connect inputs to outputs
  • Zero propagation delay, zero ground bounce
  • Low power CMOS proprietary technology
  • Undershoot clamp diodes on all switch and control inputs
  • Direct bidirectional connection for mux
  • Available in 28 pin QSOP package

产品选择

器件号 Part Status Pkg. Type Lead Count (#) Temp. Grade Pb (Lead) Free Carrier Type Buy Sample
QS3390QG
Active QSOP 28 C 是的 Tube
Availability
QS3390QG8
Active QSOP 28 C 是的 Reel
Availability

文档和下载

文档标题 其他语言 类型 文档格式 文件大小 日期
数据手册与勘误表
QS3390 Datasheet 数据手册 PDF 143 KB
应用指南 &白皮书
AN-11: 5V and 3V Conversion with Zero Delay 应用文档 PDF 417 KB
Quickswitch Basics 应用文档 PDF 142 KB
AN-19: Space Reduction Via Placement 应用文档 PDF 41 KB
AN-09: CMOS Bus Switches Provide 0 Delay 应用文档 PDF 121 KB
AN-20: Board Assembly for 0.4mm Pin Surface Mounts 应用文档 PDF 62 KB
AN-17: Peripheral Isolation in Notebook Computers 应用文档 PDF 68 KB
AN-13: Converting TTL to Hot Plug 应用文档 PDF 85 KB
TN-07: Analysis of QuickSwitch Behavior 应用文档 PDF 102 KB
PCN / PDN
PCN# : A1808-01 Transfer Assembly Location from Amkor Philippines for select pacakges 产品变更通告 PDF 39 KB
PCN# : TB1504-01R1 Qty per Reel Standardization for Selective Packages 产品变更通告 PDF 95 KB
PCN# : TB1504-01 Qty per Reel Standardization for Selective Packages 产品变更通告 PDF 50 KB
PCN#: A-0410-02, Change IDT marking logo with new IDT gridless w 产品变更通告 PDF 24 KB
PCN# A-0508-02: OSET Alternate Assembly Location for Green 产品变更通告 PDF 18 KB
PCN#: TB-0504-01, Transfer Test & Backend from IDT-Manila to IDT 产品变更通告 PDF 35 KB
PCN # A-0406-07Rev.1, Qualify OSE-Taiwan for SSOP & TSSOP 产品变更通告 PDF 21 KB
PCN#:A-0401-01, new m/c G600 & 8290 d/a material 产品变更通告 PDF 196 KB
PCN#:A-0312-01, new mold compound material - G600 产品变更通告 PDF 109 KB
PCN#:A-0312-02, new die attach material - 8290 产品变更通告 PDF 116 KB
PCN# L0212-01 Fab Site Change to Fab 4 产品变更通告 PDF 50 KB
PCN# G-0203-05 Mold Compound 产品变更通告 PDF 40 KB
PCN# G0005-01, Laser Top Mark 产品变更通告 PDF 24 KB
下载
QS3390 Hspice 模型 - HSPICE ZIP 6 KB
QS3390 IBIS model 模型 - IBIS ZIP 4 KB