文档标题 信息
Package Description SBGA 31.00x31.00x1.10 mm 1.00mm Pitch
Package Status Active
Package Type SBGA
类别 PLASTIC
Package Code BXG500
分类 G
Lead Count 500
Pb (Lead) Free Yes
长度 31mm
Pb Free Category e1 SnAgCu
宽度 31mm
Thickness 1.1mm
Peak Reflow Temp 260.00°C
Pitch 1mm
Package Carrier Tray
Pkg. Dimensions (mm) 31.0 x 31.0 x 1.1

文档
类型 文档标题 日期
证书
Green Products RoHS Material Declaration Certificate
PDF 170 KB
Package Outline Drawing
BX/BXG/RX 500 PACKAGE OUTLINE 31.0 x 31.0 mm BODY 1.0 mm BALLPITCH SBGA
PDF 241 KB
产品变更通告
PCN# : A-0610-01 Transfer of IDT Penang Assembly to AIT
PDF 174 KB
3 items