Medium-class vehicles that are popular globally are equipped with in-vehicle computers in a variety of forms, combinations of which are used to build systems suitable for a given region or grade of vehicle. Compared to the previously released R-Car H3, the functionality and capabilities of the R-Car M3 have been optimized so that it can be used for a wide variety of purposes. Automotive manufacturers and part manufacturers can use the R-Car M3 in a wide variety of automotive computing devices according to their requirements. The R-Car M3 is fully software-compatible with the R-Car H3, so existing software resources can be used effectively.

The R-Car M3 is available as a standalone chip and also as a system-in-package (SiP) module already mounted with DDR memory. The difficulty of designing a connection is increasing due to faster connection speeds between an SoC and DDR memory, or an increasing number of connection signals. The R-Car M3 SiP module offered by Renesas helps alleviate this design burden.

特性

  • Compliant with ISO 26262 (ASIL-B) functionality safety standard for automotive
  • Optimized functions and performance enable use in a wide range of applications
  • Availability of SIP modules with external memory to reduce the design workload
  • Compatibility with previous products enables use of the existing ecosystem and access to over 180 R-Car Consortium partners

应用

  • Medium-class automotive computing systems

文档和下载

文档标题 其他语言 类型 文档格式 文件大小 日期
其他
Low-Cost Integrated Cockpit With Renesas R-Car – 传单 PDF 1.83 MB
R-Car H3 / M3 User's Manual – 其他 PDF 13.71 MB
Emotion Recognition Engine SDK (R-Car M3) – 库 ZIP 461.99 MB
R-Car M3 Device Manual – 其他 PDF 949 KB
info: For device-specific or order-specific documentation, submit a support request.

开发板与套件

器件号 文档标题 类型 Company
R-Car-H3-M3-Starter-Kit R-Car H3 and M3 Starter Kit 入门 Renesas

新闻及更多资源

类型 日期
Renesas FAQ (Knowledge Base) site (for R-Car H3 and M3 Starter Kit) External Link 2021年4月13日
R-Car H3/M3 (Cockpit) Forum (for R-Car H3 and M3 Starter Kit) External Link 2020年9月1日
R-Car 联盟 基本页面 2020年8月9日
Automotive Software & Tools 基本页面 2020年5月5日

Specification

Item R-Car M3 Specifications
Product Name
(Part Number)		 R-Car M3 (R8J77960 (SiP), R8A77960 (SoC))
Power Supply Voltage 3.3V/1.8V (IO), 1.1V (LPDDR4), 0.9V (core)
CPU Core Arm® Cortex®-A57
Dual		 Arm® Cortex®-A53
Quad		 Arm® Cortex®-R7
Dual Lockstep
Cache Memory L1 instruction cache: 48KB
L1 operand cache: 32KB
L2 cache: 1MB		 L1 instruction cache: 32KB
L1 operand cache: 32KB
L2 cache: 512KB		 L1 instruction cache: 32KB
L1 operand cache: 32KB
External Memory LPDDR4-SDRAM
Maximum operating frequency: 1600MHz
Data bus width: 32 bits x 2 ch (12.8GB/s x 2)
3D Graphics Imagination Technologies’ PowerVR® Series 6XT GX6250
Video Display out x 3 ch
Video input x 8 ch
Video codec module (H.265, H.264/AVC, MPEG-4, VC-1, etc.)
IP conversion module
Up and down scaling, 1-D LUT/3D-LUT/1D-Histogram/2D-Histogram, color conversion, super resolution, rotate, ordered dithering, sharpness, lossless compression/decompression, lossy compression

TS interface x 2 ch
Stream and security processor
Distortion compensation module x 4 ch (IMR-LX4)
High performance real-time image recognition engine (IMP-X5)
Audio Audio DSP
Sampling rate converter × 10 ch
Serial sound interface × 10 ch
Storage Interfaces USB 3.0 host interface (DRD) × 1 port (wPHY)
USB 2.0 host interface × 1 port (wPHY)
USB 2.0 host/function/OTG interface × 1 port (wPHY)
SD host interface × 4 ch (SDR104)
Multimedia card interface × 2 ch
PCI Express 2.0 (1 lane) x 2 ch
In-car Network and
Automotive Peripherals		 Media local bus (MLB) interface × 1 ch (3-pin interface)
Controller Area Network (CAN-FD support) interface × 2ch
Ethernet AVB 1.0-compatible MAC built in
Interface: RGMII
Ethernet AVB (802.1BA)
  • IEEE802.1BA
  • IEEE802.1AS
  • IEEE802.1Qav
  • IEEE1722
Security Crypto engine (AES, DES, Hash, RSA) x 2 ch
System RAM
Other Peripherals SYS-DMAC x 48 ch, real-time-DMAC x 16 ch,
Audio-DMAC x 32 ch, audio (peripheral)-DMAC x 58 ch
32-bit timer x 41 ch
PWM timer × 7 ch
I2C bus interface × 8 ch
Serial communication interface (SCIF) × 11 ch
SPI multi I/O bus controller (RPC) × 1 ch (HyperFlashTM/QSPI support)
Clock-synchronized serial interface (MSIOF) × 4 ch (SPI/IIS)
Digital radio interface (DRIF) × 4 ch
Low Power Mode Dynamic power shutdown
AVS (Adaptive Voltage Scaling), DVFS (Dynamic Voltage and Frequency Scaling), DDR-SDRAM power supply backup mode
Package 1255-pin SiP module (40mm x 40mm, 0.8mm pitch)
1022-pin Flip chip BGA (29mm x 29mm, 0.8mm pitch)
Development
Environment		 ICE for Arm CPU available from tool vendors
Evaluation Board A user system development reference platform with the following features is also available to enable the users to carry out efficient system development.
(1) Incorporates car information system-oriented peripheral circuits, providing users with an actual device verification environment.
(2) Can be used as a software development tool for application software, etc.
(3) Allows easy implementation of custom user functions.
Software Platform Support OS: Linux, AndroidTM, QNX® Neutrino® RTOS, Integrity® etc.
OpenGL ES3.1 3D graphics library, wide variety of H.265, H.264, MPEG-4 and VC-1 for video compliant with OpenMAX IL I/F in addition to BSPs compliant with OSs standard API are available to realize complete system concept.

(Remarks)
Arm and Cortex are registered trademarks of Arm Limited.
PowerVR is a trademark of Imagination Technologies Limited.
Android is a registered trademark from Google Inc.
QNX, neutrino and Blackberry are trademarks from BlackBerry Limited, and are used with permission from QNX Software System Limited.
Green Hills Software and INTEGRITY are trademarks or registered trademarks of Green Hills Software, Inc. in the U.S. and/or internationally.
HyperFlash is a trademark of Spansion LLC in the United States and other countries.
All names of other products or services mentioned are trademarks or registered trademarks of their respective owners.