文档标题 信息
Package Name W5X7.35D
Package Previous Code WQQ
Package Description 5x7 35 Balls, 0.4mm Pitch, WLCSP - UAT
Package Status Active
Package Type WLCSP-TKCURDL
Package Code WQQ
分类 PLASTIC
Lead Count 35
Pb (Lead) Free Yes
长度 3.4mm
宽度 2.39mm
Thickness 0.5mm
Pitch 0.4mm
Pkg. Dimensions (mm) 3.40 x 2.39 x 0.50

文档
类型 文档标题 日期
Package Outline Drawing
W5x7.35D: 35 Ball Wafer Level Chip Scale Package (WLCSP 0.4mm Pitch)
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