文档标题 信息
Package Name W3X3.9H
Package Previous Code WPL
Package Description 9 Ball 3x3 Array UltraThin Wafer Level Chip Scale Package (WLCSP 0.4mm Pitch)
Package Status Active
Package Type WLCSP-BP
类别 PLASTIC
Package Code WPL
分类 PLASTIC
Lead Count 9
Pb (Lead) Free Yes
长度 1.45mm
宽度 1.45mm
Thickness 0.28mm
Pitch 0.4mm
Pkg. Dimensions (mm) 1.45 x 1.45 x 0.28

文档
类型 文档标题 日期
Package Outline Drawing
Package Drawing WLCSP-BP 9pin W3X3.9H
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