文档标题 信息
Package Name W8X8.64
Package Previous Code WDC
Package Description 8x8 Array 64 Balls, 0.5mm Pitch, Wafer Level Chip Scale (ASE), Chung-Li, Taiwan
Package Status Active
Package Type WLCSP-TCURDL
类别 PLASTIC
Package Code WDC
分类 PLASTIC
Lead Count 64
Pb (Lead) Free Yes
长度 4.03mm
宽度 4.03mm
Thickness 0.6mm
Pitch 0.5mm
Pkg. Dimensions (mm) 4.03 x 4.03 x 0.60

文档
类型 文档标题 日期
Package Outline Drawing
Package Drawing WLCSP-TCURDL 64pin W8X8.64
PDF 160 KB
1 item