文档标题 信息
Package Name V60.5.71X8.46
Package Previous Code VPI
Package Description 60 LEADS/BUMPS FCCSP (5.71 x 8.46): Amkor Technology Korea (ATK)
Package Status Active
Package Type LFBGA
类别 PLASTIC
Package Code VPI
分类 PLASTIC
Lead Count 60
Pb (Lead) Free Yes
长度 5.71mm
宽度 8.46mm
Thickness 1.12mm
Pitch 0.8mm
Pkg. Dimensions (mm) 5.71 x 8.46 x 1.12

文档
类型 文档标题 日期
Package Outline Drawing
V60.5.71x8.46: 60 Flip Chip - Chip Scale Package (FCCSP)
PDF 203 KB
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