文档标题 | 信息 |
---|---|
Package Name | R64.C |
Package Previous Code | RNY |
Package Description | 64 LD CQFP, SOLDER SEAL WITH BOTTOM HEATSINK |
Package Status | Active |
Package Type | CQFP |
类别 | HERMETIC |
Package Code | RNY |
分类 | HERMETIC |
Lead Count | 64 |
Pb (Lead) Free | Yes |
长度 | 14.1mm |
宽度 | 14.1mm |
Thickness | 0mm |
Pitch | 0.64mm |
Pkg. Dimensions (mm) | 14.10 x 14.10 x 0.00 |