文档标题 信息
Package Name SUBG0025LA-A
JEITA Standard S-UFBGA25-2.14x2.27-0.40
Package Description Terminal Material - Base: Sn-Ag-Cu
Package Status Active
Package Type S-UFBGA
类别 IC
Package Code pkg_20045
Lead Count 25
Pb (Lead) Free Yes
长度 2.27mm
宽度 2.14mm
Thickness 0.53mm
Pitch 0.4mm
Pkg. Dimensions (mm) 2.27 x 2.14 x 0.53

文档

类型 文档标题 日期
Package Outline Drawing PDF 134 KB
1 item