文档标题 信息
Package Name D24.6
Package Previous Code HCC
Package Description 24 LD SBDIP, SOLDER SEAL
Package Status Active
Package Type SBDIP
类别 HERMETIC
Package Code HCC
分类 HERMETIC
Lead Count 24
Pb (Lead) Free Yes
长度 30.48mm
宽度 15.11mm
Thickness 2.41mm
Pitch 2.54mm
Pkg. Dimensions (mm) 30.48 x 15.11 x 2.41

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文档标题 language 类型 文档格式 文件大小 日期
d24.6: 24 Lead Ceramic Dual-In-Line Metal Seal Package Package Outline Drawing PDF 13 KB

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