Package Information
| CAD Model: | View CAD Model |
| Pkg. Type: | DPAK |
| Pkg. Code: | |
| Lead Count (#): | |
| Pkg. Dimensions (mm): | |
| Pitch (mm): |
Environmental & Export Classifications
| Moisture Sensitivity Level (MSL) | 3 |
| ECCN (US) | EAR99 |
| HTS (US) | 8541.49.7040 |
| Pb (Lead) Free |
Product Attributes
| Pkg. Type | DPAK |
| Carrier Type | Tape & Reel |
| Moisture Sensitivity Level (MSL) | 3 |
| Mounting Type | Surface Mount |
| Temp. Range (°C) | -55 to +150°C |
| Country of Assembly | CHINA |
| Country of Wafer Fabrication | JAPAN |
| Ciss (Typical) (pF) | 487 |
| Coss (Typical) (pF) | 16.3 |
| FET Type | N-Channel |
| Id max @ 25°C (A) | 8 |
| Published | Yes |
| Qg typ (nC) | 5.4 |
| Qoss (nC) | 17 |
| Qualification Level | Standard |
| Quality Level | Standard |
| RDSON (Typ) (mΩ) | 240 |
| RDSON (max) (mΩ) | 312 |
| Ron * Qoss (FOM) | 4080 |
| V(TR)DSS max (V) | 800 |
| Vds min (V) | 700 |
| Vth typ (V) | 2 |
| trr (Typical) (nS) | 29 |
Resources for TP70H240G4ZS
Description
The TP70H240G4ZS 700V, 240mΩ, Gallium Nitride (GaN) FET is a normally-off device using Renesas’ Gen IV SuperGaN® platform. It integrates high-voltage GaN High Electron Mobility Transistor (HEMT) and low-voltage silicon MOSFET technologies, delivering superior reliability and performance. Renesas GaN provides higher efficiency than silicon by reducing gate charge, crossover loss, and reverse recovery charge. The TP70H240G4ZS is available in a DPAK (TO-252) package with a common-source configuration.