Package Information
| CAD Model: | View CAD Model |
| Pkg. Type: | MOD |
| Pkg. Code: | |
| Lead Count (#): | 88 |
| Pkg. Dimensions (mm): | 19.6 x 18 x 2.7 |
| Pitch (mm): |
Environmental & Export Classifications
| Moisture Sensitivity Level (MSL) | 3 |
| Pb (Lead) Free | Yes |
| ECCN (US) | |
| HTS (US) |
Product Attributes
| Pkg. Type | MOD |
| Lead Count (#) | 88 |
| Carrier Type | Tray |
| Moisture Sensitivity Level (MSL) | 3 |
| Pb (Lead) Free | Yes |
| Temp. Range (°C) | -20 to +60°C |
| Country of Assembly | Taiwan |
| Country of Wafer Fabrication | United States |
| Bandwidth (MHz) | 0.0113 |
| Charge Control | NiMH and Alkaline batteries |
| Data Rate (Mbps) | 0.0016 |
| Device Functions | Module |
| I/O Type | UART, SPI, PCM |
| MOQ | 600 |
| Memory External | No |
| Pkg. Dimensions (mm) | 19.6 x 18 x 2.7 |
| Power Amplifier | 23 |
| Price (USD) | $13.88375 |
| Processor CPU MIPS (MIPS) | 80 |
| Processor DSP MIPS (MIPS) | 80 |
| Qty. per Reel (#) | 600 |
| Radio DECT (6.0) | Yes |
| Radio JDECT | Yes |
| Radio KDECT | No |
| Software Support | Flexible API Interface |
Resources for SC14CVMDECT
Description
The SC14CVMDECT Cordless Voice Module (CVM) Development Kit consists of two development boards with headsets, enabling voice connection setup. It enables the easy and cost-effective development of cordless applications and significantly reduces the time-to-market.
All the features of the module are accessible through the pins on the development board, while buttons and LED statuses can be changed and checked. The CVM kit comes with the Athena development environment, an Eclipse-based IDE that provides a development environment for the CR16C+ series of microcontrollers, and a GNU cross compiler/linker for CR16 – removing the need for an external microcontroller.