Package Information
| CAD Model: | View CAD Model |
| Pkg. Type: | WAFER |
| Pkg. Code: | DICEW |
| Lead Count (#): | |
| Pkg. Dimensions (mm): | 0.0 x 0.0 x 0.0 |
| Pitch (mm): |
Environmental & Export Classifications
| Moisture Sensitivity Level (MSL) | |
| Pb (Lead) Free | Yes |
| ECCN (US) | EAR99 |
| HTS (US) | 8542.39.0090 |
Product Attributes
| Lead Count (#) | 0 |
| Carrier Type | WFP |
| Pb (Lead) Free | Yes |
| Pb Free Category | e3 Sn |
| Temp. Range (°C) | -5 to 100°C |
| Country of Wafer Fabrication | USA |
| Application | 200Gbps advanced multi-level modulation systems, 400Gbps advanced multi-level modulation systems, Next generation small form factor such as CFP2/4 |
| Channels (#) | 1 |
| Data Rate Max (Gbps) | 32 |
| Function | Linear Driver |
| MOQ | 400 |
| Output Type | Differential |
| Output Voltage (V) | 3V |
| Pkg. Dimensions (mm) | 0.0 x 0.0 x 0.0 |
| Pkg. Type | WAFER |
| Price (USD) | $24.59773 |
| Published | No |
| Qty. per Carrier (#) | 0 |
| Qty. per Reel (#) | 0 |
| Requires Terms and Conditions | Does not require acceptance of Terms and Conditions |
| Tape & Reel | No |
Resources for GX72170
Description
The GX72170 is a high-performance linear Mach-Zender Modulator (MZM) driver designed for 100G DP-QPSK and 200G/400G DP-mQAM metro, and long-haul optical Small-Form-Factor (SFF) transmitters.
The GX72170 is a broad band and ultralow power SiGe single-channel amplifier die, and integrates a linear pre-amplifier and a post-amplifier with AC-coupled differential input and differential output interfaces. The device can drive a linear output voltage of 3.0Vppd with differential characteristic impedance of around 50Ω.