The ISL71xxxM family of radiation tolerant plastic-package ICs is designed to support the emerging field of small satellites that will provide solutions such as high-speed Internet connections to hundreds of millions of users in communities, governments, and businesses worldwide. Fleets of hundreds of small satellites will create mega-constellation networks to deliver broadband Internet links from low Earth orbit (LEO) to every corner of the globe, including rural areas without wireless connectivity access.
Renesas' rad tolerant plastic packaging flow leverages the company's more than 50 years of spaceflight experience developing rad hard (>75krad) and rad tolerant (<75krad) products for extremely harsh environments. The upfront radiation affects characterization and AEC-Q100 automotive-like qualification gives customers the utmost confidence to design Renesas radiation tolerant plastic parts into cost-sensitive small satellites for LEO mission profiles up to five-years. The ISL71xxxM are also well suited for high altitude (>40km) avionic systems, launch vehicles that are prone to heavy ions, and medical equipment where radiation is a concern.