Evaluation Kit for ZSSC3018
The ZSSC3018KIT Evaluation Kit provides the hardware needed for configuration, calibration and evaluation of the ZSSC3018 Sensor Signal Conditioner (SSC) IC. The user's...
概览
简介
The ZSSC3018 is a sensor signal conditioner (SSC) integrated circuit for high-accuracy amplification and analog-to-digital conversion of differential or pseudo-differential input signals. Designed for high-resolution sensor module applications, the ZSSC3018 can perform offset, span, and 1st and 2nd order temperature compensation of the measured signal. Developed for correction of resistive bridge or absolute voltage sensors, it can also provide a corrected temperature output measured with an internal sensor. The measured and corrected sensor values are provided at the digital output pins, which can be configured as I2C (≤ 3.4MHz) or as SPI (≤ 10MHz). Digital compensation of signal offset, sensitivity, temperature, and non-linearity is accomplished via a 26-bit internal digital signal processor (DSP) running a correction algorithm. Calibration coefficients are stored on-chip in a highly reliable, non-volatile, multiple-time programmable (MTP) memory. Programming the ZSSC3018 is simple via the serial interface. The interface is used for the PC-controlled calibration procedure, which programs the set of calibration coefficients in memory. The ZSSC3018 provides accelerated signal processing, increased resolution, and improved noise immunity in order to support high-speed control, safety, and real-time sensing applications with the highest requirements for energy efficiency.
特性
- Flexible, programmable analog front-end design, up to 18-bit analog-to-digital converter (ADC)
- Fully programmable gain amplifier with gain range from 6.6 to 216 (linear)
- Internal auto-compensated temperature sensor
- Digital compensation of individual sensor offset
- 1st and 2nd order digital compensation of sensor gain as well as of 1st and 2nd order temperature gain and offset drift
- Programmable interrupt operation
- High-speed sensing: e.g., 16-bit conditioned sensor signal measurement rate >500s-1
- Typical sensor elements can achieve an accuracy of better than ±0.01% full-scale output
产品对比
应用
文档
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| 类型 | 文档标题 | 日期 |
| 数据手册 | PDF 1.15 MB | |
| 概览 | PDF 2.92 MB 日文 | |
| 指南 | 7Z 1.21 MB | |
| 技术摘要 | PDF 1.06 MB | |
| 数据手册 - 简易格式 | PDF 238 KB | |
| 手册 - 开发工具 | PDF 2.04 MB | |
| 技术摘要 | PDF 500 KB | |
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设计和开发
软件与工具
开发板与套件
开发板与套件
模型
ECAD 模块
Schematic symbols, PCB footprints, and 3D CAD models from SamacSys can be found by clicking on products in the Product Options table. If a symbol or model isn't available, it can be requested directly from the website.
Processing table
| VFQFPN | 13-inch Reel | 24 | -40 to 125°C | Reel | 1 | 获取样片, | |
| WAFER | 304µm thickness | 0 | -40 to 125°C | Wafer | 1 | ||
| WAFER | 725µm thickness | 0 | -40 to 125°C | Wafer | 1 | ||
| WAFER | 725µ die on sawn wafer | 0 | -40 to 125°C | Wafer | 1 | ||
| WAFER | 725µ die in waffle pack | 0 | -40 to 125°C | WFP | 1 |
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视频和培训
IDT Sensor Signal Conditioner (SSC) Evaluation Kit Overview
A brief introduction and overview of IDT's sensor signal conditioner evaluation kits. Evaluation kits generally consist of three parts: a communication interface board, a device board, and a sensor simulator board - all connected together. A sophisticated software GUI accompanies the kit, enabling an engineer to learn how to use the part rapidly, do quick prototyping, and practice calibrations.
Presented by David Grice, applications engineer at IDT. For more information about IDT's sensor signal conditioner products, visit https://www.idt.com/ssc
Video List