电源管理

概览

MOSFETs suitable for switching (motor drive, etc.) and load switch applications. Low on-resistance, high-speed switching, and high-robustness.

文档

文档标题 类型 日期
RJK6006DPP-A0 Datasheet
PDF161 KB
数据手册
Power MOS FET APPLICATION NOTE
PDF3.27 MB日本語
应用文档
Attention of Handling Semiconductor Devices
PDF648 KB日本語
应用文档
Avalanche Guarantee for Power MOS FET Application Note (D18464EJ2V0AN00)
PDF585 KB日本語
应用文档
Analog ICs Brochure
PDF2.72 MB日本語
手册
Discrete & Power Devices Brochure
PDF1.92 MB
手册
功率管理半导体分立器件无铅产品
PDF665 KBEnglish, 日本語
传单
半导体封装安装手册
PDF10.28 MBEnglish, 日本語
其他
功率MOS FET 功率MOS FET使用时的注意事项
PDF1.60 MB
其他
功率MOS FET 应用例子
PDF721 KB
其他
可靠性手册
PDF15.93 MB
其他
Unification of a JEDEC tray and a embossed carrier tape for LQFP package (Additional Information & Correction)
PDF4.86 MB日本語
产品变更通告
Unification of a JEDEC tray and a embossed carrier tape for LQFP package ( PC-WRP-A001B/E )
PDF3.74 MB日本語
产品变更通告
Unification of a JEDEC tray and a embossed carrier tape for LQFP package ( PC-WRP-A001A/E )
PDF1.46 MB日本語
产品变更通告
Transistor Change of reel material
PDF224 KB日本語
Technical Update
Changes of the shipping forms and materials by applying the unified packing specification
PDF695 KB日本語
Technical Update
Inner box change according to dampproof bag change and dampproof bag change
PDF3.10 MB日本語
Technical Update
Standardization of moisture-proof aluminum bags and addition of drying agent specifications (expansion of target products)
PDF324 KB日本語
Technical Update
Change of inner packing label
PDF343 KB日本語
Technical Update
Change of TO-3P Package for Power MOSFET
PDF536 KB日本語
Technical Update
Addition of Production Line for MPAK
PDF214 KB日本語
Technical Update
Change of content printed on the side of inner box
PDF31 KB日本語
Technical Update
Addition of Shipping Tray Type for LQFP2020 Packages
PDF126 KB日本語
Technical Update
LFPAK LFPAK-i Packing Specification Change
PDF78 KB日本語
Technical Update
Change of Carrier Tape Material *Change from polyvinyl chloride (PVC) to polystyrene (PS).
PDF41 KB日本語
Technical Update
Lead Free method change of TO-3PFM externals transistor
PDF61 KB日本語
Technical Update
Changing the plating composition on the lead terminals (Lead-free)
PDF28 KB日本語
Technical Update
Spec change of packing(RENESAS unified packing specification)
PDF381 KB日本語
Technical Update
 
info: For device-specific or order-specific documentation, submit a support request.

设计和开发

ECAD 模块

Schematic symbols, PCB footprints, and 3D CAD models from SamacSys can be found by clicking on products in the Product Options table. If a symbol or model isn't available, it can be requested directly from the website.

扩展 ECAD 模块

产品选择

Loading products for parametric search...

产品选择

器件号
Pkg. Type
Carrier Type
购买 / 样片
Parametric Table tips

支持

联系技术支持获取样片MOSFET常见问题